Electronics Forum: check (Page 571 of 631)

World Class First Time Yield

Electronics Forum | Mon Dec 08 18:52:47 EST 2003 | Craig M

Stability of process is what your measuring so lets not assume a stable process(if your process was perfect you would have no defects). With no test a medium complexity board will be around 68.7% (according to Consulogic). I dont have many other sour

Pre heat temperature in Solder wave

Electronics Forum | Tue Dec 16 06:42:51 EST 2003 | Kev

I am having problems achieving correct pre-heater temperatures with our Hollis solder wave. Our original "Verification Golden board" program uses a conveyor speed of 5ft per minute and pre-heat temps of 300, 350, 400 respectively. Our "golden Board"

reballing

Electronics Forum | Thu Jan 22 15:51:08 EST 2004 | solderboffin

CBGA devices are a bit trickier to reball than run of the mil plastic devices. Once assemblied they are a bit like a sandwich when fitted to a PCB. From top to bottom it goes BGA device - Eutectic solder - High temp solder ball - eutectic solder -

Gold surface contam after prebake 150C for 3 hrs

Electronics Forum | Wed Apr 07 22:15:31 EDT 2004 | davef

We're not familiar with the AUG5 from Taiyo. [It doesn't show on their US site.] Is it liquid photoimageable? Printed solder masks are more likely to bleed. But you wouldn't have any solderability with bleed. Your plating seems acceptable [if th

Recomendations? Fuji CP7 or Univ HSP4797?

Electronics Forum | Wed Mar 30 17:35:18 EST 2005 | Grant

Hi, Yes, it was fun reading this thread again. We initially upgraded our MY9 to a MY12 with line scan camera, but it was still too slow. We considered getting a second MYDATA, but decided to go with some FuJi XP 142, and 242 machines, with a second

Gold Embrittlement

Electronics Forum | Tue Jun 01 10:11:00 EDT 2004 | davef

Intermetallic growth is a diffusion process, the thickness of the intermetallic is given by: z^2 = (Do)(t)exp[-Q/RT] Where Do (m2 s-1) is the diffusion coefficient, T(�K) is the temperature, Q (J mol-1) is the activation energy and R (8.314 J mo

Palladium silver surface finish

Electronics Forum | Fri Aug 13 16:54:20 EDT 2004 | davef

If the terminations on your components are not barrier plated, you must be very careful about the amount of time you stay above liquidous. As you'd expect, longer is not better. The longer you stay at liquidous, the more of the component terminatio

MPM AP-20 drivers

Electronics Forum | Mon Jul 26 21:56:53 EDT 2004 | pdeuel

The camera is not driven from the motor cards. The camera is attached to what is called a forcer. For the Y axis there are two of them. One is wired backwards from the other. one of the forcers is connected to a flex chanell for the air and electrica

flux on PCB's after cleaning

Electronics Forum | Fri Jul 23 14:41:41 EDT 2004 | Steve Stach

Dear JSK, It sounds like the root causes of your problem are two fold. First, excessive heat will polymerize the abietic acid found in rosin forming neo-abietic diamers and polymers which are much less soluble than the parent monomer. There are

Crystalized Flux under BGA

Electronics Forum | Wed Aug 04 00:17:41 EDT 2004 | Shean Dalton

Additionally, increases in temperature can increase the water's rate of reaction with the flux. Sometimes, only a 5 degree change can make the cleaning difference. If the flux inconsistently presents itself, then the likely cause is something in


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