Electronics Forum | Sat Mar 29 07:07:01 EST 2003 | mk
http://www.sipad.com/Motorola/MotorolaFlipChip.htm Check out this link. Sounds similar. mk
Electronics Forum | Tue Apr 01 19:45:48 EST 2003 | mk
Try checking into ssd www.sipad.com No clean process for the whole board. Contamination from paste is removed before you get the boards. http://www.sipad.com/Motorola/MotorolaFlipChip.htm mkehoe@sipad.net
Electronics Forum | Fri Apr 11 00:32:17 EDT 2003 | Joe
Hello, Regarding the failures not showing up at ICT. Failed decoupling caps are notoriously difficult to diagnose within ICT. Check with your test engineering folks and ask them how they've coded for these parts. I doubt that they will say those
Electronics Forum | Wed Apr 16 08:15:55 EDT 2003 | davef
Check with your temperature profile equipment supplier [eg, KIC, ECD, etc]. We use a download from ECD that lists most ovens and solder pastes that make it [or one like from another supplier] a good place to start.
Electronics Forum | Thu May 01 17:49:33 EDT 2003 | jym2000
Did you check board orientation into the reflow oven? (The Layout components are the same products A & B?) Regards Jesus
Electronics Forum | Mon May 05 02:37:11 EDT 2003 | gaoliangcheng
Maybe you can check the thickness of the solder mask between the pads. If the highest of the solder mask exceed the pad,then the component which was placed will be unbalanced.
Electronics Forum | Wed May 28 11:56:18 EDT 2003 | blnorman
Yes we are using "silicones", but to find this contaminant we were looking for "silicon" the element by SEM/EDS. We use Dow materials and my contact there is checking to see if they have any info.
Electronics Forum | Fri May 07 18:34:55 EDT 2004 | Ron Herbert
Bruce, You didn't mention whether you had checked the specific gravity of the flux. Also, most flux manufacturers recommend getting rid of the flux after 40 hours of use.
Electronics Forum | Thu Jun 12 12:41:33 EDT 2003 | rmurtuza
I really appreciate the Information JB, T, Vick, and Stepheno provided me with my problem. I will work on preventive maintenance and will also check the component database. Please provide me with any additional pointers that will help me optimize my
Electronics Forum | Wed Jun 25 18:35:28 EDT 2003 | Brian W.
Most of the time, Ceramic cracks are cracked due to mechanical stress. Check your depaneling methods. Cermaic caps that are close and perpendicular to the board edge are especially susceptible.
