Electronics Forum | Tue Dec 05 13:59:40 EST 2006 | Todd
The "Relay PCB" is # CON I/F 8909-0. Of course it's a real old drawing with many of the P/Ns being obsolete. I'm looking at drawing # SIP-1750. The Relay PCB is shown between the 1st station connectors and the control box. In the meantime, I'll doubl
Electronics Forum | Thu Dec 07 07:36:15 EST 2006 | callckq
Hi Davef, The BGA pad is with ENIG finish, the PCB pad is with immersion silver and the solder paste is with SAC type. I already checked, the solder paste Cu is just 0.5%..Hence, I am guessing that copper migration is from PCB pad. No way it is fr
Electronics Forum | Fri Dec 15 01:37:21 EST 2006 | shrikant_borkar
Hi, Hemendra Recently, We have carried out lead Free Soldering On our 4+1 Panasonic Reflow machine. Results were fine , but its Not Recommended for long Run. but the machine which you have is 5 zone machine and additional 2 cooling zone too. Check
Electronics Forum | Fri Dec 22 09:19:11 EST 2006 | simonlee
Our VIP98 oven just refused to do anything this morning, no previous history of problems. Conveyor and heaters do not start up. None of the Solid State Relays in the back of the unit are operating, although we can make them switch by wiring up to t
Electronics Forum | Fri Dec 22 12:58:23 EST 2006 | MFG CAVEMAN
Simon, In a previous life, I came upon a maintenance tech that had an old vapor phase oven control cabinet half ripped apart for a main power problem. I asked him if he had checked to see if any of the E-Stop swtiches had been hit. One had been ac
Electronics Forum | Wed Feb 07 16:16:10 EST 2007 | mr
I have seen this before. Check: --Vibration of belt --Interference (part getting "brushed off" while reflowing bottom-side components --Some glues' cross-linking mechanism is impaired by the flux during migration in reflow, redering the glue useless
Electronics Forum | Thu Jan 11 04:10:15 EST 2007 | fpcb
This was helpfull. Thnks . The Program origin was far away from the fiducials. Thats why I have this message. Now the next problem: I insert command N2 with M801 , I go at 1st fiducial .... all ok I insert command N3 with
Electronics Forum | Wed Jan 17 15:13:24 EST 2007 | jaime39
When placing the part to be reflow try applying heat to the board from the secondary side until the primary side has a temperature of about 130 degrees celcius. Following this procedure it should minimize the heat exposure of the part being soldered.
Electronics Forum | Thu Jan 18 15:47:52 EST 2007 | Jeff
>What was your package temp during this reflow process? I >>know you had balls at 245 but what about the case itself? I did not measure the temperature of a package. My thermocouples are 36AWG - around 0.01" diameter, so about the only way I imagine
Electronics Forum | Wed Jan 24 21:29:43 EST 2007 | davef
Board fabricators commonly use Barco AOI to inspect film. The AccuMatch compares pixel-to-pixel of the Gerber data to the image seen by the AOI camera. It's slower than design rule checking, but has definite advantages [like lower falsing]. Unfortu
