Electronics Forum: checking (Page 556 of 631)

Re: Moisture Sensitivity and Package Cracking

Electronics Forum | Tue Feb 02 11:07:36 EST 1999 | justin.medernach@flextronics.com

| Greetings, | | We are discussing what should and what should not be baked and vacuum packed. Should we just concentrate on the fine pitch packages and the bga's? | What about those components which come on blister tape, should they get baked and r

Re: the SOD-80 er the MELFs

Electronics Forum | Mon Jan 25 21:25:46 EST 1999 | Dave F

| | I am searching for application notes on the SOD-80. Also, I am looking for any problems that have been discovered while using it. Also, we are looking for the pick and place equipment upgrades that will be needed to use the package- Pricing, ma

Re: Board Stress

Electronics Forum | Wed Jan 20 14:21:54 EST 1999 | Dave F

| I need some opinions (And I know everybody has one). | I am mounting a board into a case, after mounting the board | I am loading it with stress in the middle causing it to bend around .030 inch. The board is 4" X 6" and is Bending in the 4" dire

Re: Surface Mount Connector Strength

Electronics Forum | Thu Jan 14 23:38:34 EST 1999 | Chris G.

| I am experiencing a problem with a surface mount coax connector that over time pulls loose from the PWB. The connector has 4 small gold plated leads and we are soldering it to a flash gold board. A cable plugs into the connector and puts some con

Re: Nepcon 2000???

Electronics Forum | Wed Jan 13 20:49:49 EST 1999 | Wayne Bracy

| What's going on with Nepcon next year??? | I have heard rumors allot of the big guys are moving to IPC/SMEMA show on a long beach somewhere in Calif.. | | Any info on who is planning to attend Nepcon 2k would be nice | Fuji?? | Universal??? |

Re: Selective Soldering

Electronics Forum | Tue Jan 12 00:16:15 EST 1999 | Jason Nipper

| | I need leads on equipment vendors for selective soldering systems. I have information about ERSA and Seho already. I want to contact Air Vac in particular, but I can't find thier phone number. Thanks for the help | | | Jim, | | Below are a

Re: Alpha HI FLO solder

Electronics Forum | Thu Jan 07 09:24:08 EST 1999 | Chrys

| | We are currently fighting a dross battle on our non-inerted waves. We are currently using a bar solder that barely meets QQS-571 for Alloy/Impurity. | | | | Is anybody using HI FLO in a non inerted wave? Do you see a measureable decrease in dr

Re: Wavesolder Bridging - glue dots

Electronics Forum | Mon Jan 04 11:03:14 EST 1999 | Chrys

| | | We have a new PTH board that utilizes lap pads on the B/S. Some of the pads are paired closely together and are aligned at angles (30,45,60 degrees)to the boards direction of travel through the wave. The pads most always bridge together. I rea

Pad Sizes

Electronics Forum | Thu Dec 24 01:38:36 EST 1998 | Chris Grendler

I need advice on a pad design which several other engineers whom I work with would like to try. I think it is an utterly crazy but I can't seem to convince them differently. My current 0402 chip pad sizes on alumina and FR4 substrates are .022"X.

Re: Dross Skimmin'

Electronics Forum | Sat Dec 05 17:41:07 EST 1998 | Earl Moon

| | | Have either one of you seen or used a SRS machine? I had | | | one in for a demo - very impressive. The original model was | | | a little too awkward for production to use, however, the newer | | | model is a little easier to use. The big


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