Electronics Forum | Wed Jul 05 11:44:04 EDT 2006 | Rob
We had one mechanical engineer from a certain customer telling us we had to crop components leads so they didn't protrude through the board, as they could then come in contact with the case as the board was flush. Had I have known then what I know
Electronics Forum | Wed Nov 29 00:26:39 EST 2006 | mack3000
Hello everyone, I've been facing some issues regarding:- 1)missing components 2)overturn 3)misalignments Why does this occur?Is it because of the machines?The programming?Or handling issues? What steps are needed to be taken to counter this problem
Electronics Forum | Wed Jan 31 14:07:24 EST 2007 | electronhose
Material, fumes, cured or uncured, all are suspect. Silicone gets on an operator's hands, that operator handles components ( even a day or more later ) silicone is transferred to the solder connections = contamination. Process and workcell control
Electronics Forum | Thu Apr 12 00:56:20 EDT 2007 | Jani
Our SMT production and storage area is air-conditioned, constant temperature is maintained but the humidity is not controlled , the raw SMT material is stored in a "Drier" cabinet, but since we assemble hybrid SMT and thru-hole PCB assemblies, the SM
Electronics Forum | Wed Jul 02 19:10:45 EDT 2008 | arminski
Hi, Say I'm going to calculate my PPM and DPMO, do I have to include in my defects data an item that the root cause is already identified? example is if I have 4 components with Land Design issues (incorrect dimension) and is causing me insufficient
Electronics Forum | Thu Nov 13 22:20:48 EST 2008 | davef
For your pad layout and spacing between components, look here: http://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=77b562c1-b8f8-db11-8a6a-005056875b22 For your standoff height in SMT, we do not concern ourselves with standoff height. It
Electronics Forum | Fri Mar 06 02:47:15 EST 2009 | lococost
Have you tried higher peaktemp? I saw the QFP is sn90pb10, This has a liquidus of 268 - 302 C. A good paste should be able to handle 230C (or more), of course you would need to check your other components peak temp.
Electronics Forum | Sat May 15 11:27:26 EDT 2010 | davef
We'd expect both OSP poor wetting and improper reflow recipe to show-up in more places than just this one component. But if those are the only choices, we'll go for 'wrong solder paste.' Ooops, that's not one of the choices. Ok, OK, we'll take poo
Electronics Forum | Wed Apr 06 08:27:12 EDT 2011 | kaschliman
Our two component suppliers use 99.5Sn/0.5Cu and 97Sn/3Ag solder (respectively) for tinning their leads. We use 98.9Sn/.66Cu/.33Ag solder in our wave solder machine. Is there any significant advantage to either tinning process regarding solderabili
Electronics Forum | Wed Apr 13 09:43:00 EDT 2011 | dyoungquist
A bit more information will help people give a more educated response. What size res/caps? Any fine pitch ICs? BGAs? Lead or lead free? What quantity of components and/or boards are you loading? Will it be high mix, low volume or lower mix, hig
