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SANYO - QYSMT

https://www.qy-smt.com/sanyo-sony/sanyo/page/17/

& SONY DEK ICON i8 Screen Printer DEK GALAXY Screen Printer Auto Round Blade V-cut PCB Cutting Machine ML-505 YAMAHA SMT used machine,chip mounter – YV88-X YAMAHA SMT used machine,chip mounter – YS24 YAMAHA SMT used machine,chip mounter – YV100XGP YAMAHA SMT used machine,chip mounter – YV100XG YAMAHA SMT used machine,chip mounter -YG100 JUKI SMT used machine,chip mounter – KE-2080M JUKI SMT used machine,chip mounter – KE-2050M JUKI SMT used machine,chip mounter – JX-300LED JUKI SMT used machine,chip mounter – KE-2080L JUKI SMT used machine ,Chip mounter – KE-2070M JUKI SMT used machine ,Chip mounter – FX-3RL JUKI SMT MACHINE,CHIP MOUNTER – KE-2070L I-PULSE CHIP MOUNTER , SMT MACHINE

SONY - QYSMT

https://www.qy-smt.com/sanyo-sony/sony/page/17/

& SONY DEK ICON i8 Screen Printer DEK GALAXY Screen Printer Auto Round Blade V-cut PCB Cutting Machine ML-505 YAMAHA SMT used machine,chip mounter – YV88-X YAMAHA SMT used machine,chip mounter – YS24 YAMAHA SMT used machine,chip mounter – YV100XGP YAMAHA SMT used machine,chip mounter – YV100XG YAMAHA SMT used machine,chip mounter -YG100 JUKI SMT used machine,chip mounter – KE-2080M JUKI SMT used machine,chip mounter – KE-2050M JUKI SMT used machine,chip mounter – JX-300LED JUKI SMT used machine,chip mounter – KE-2080L JUKI SMT used machine ,Chip mounter – KE-2070M JUKI SMT used machine ,Chip mounter – FX-3RL JUKI SMT MACHINE,CHIP MOUNTER – KE-2070L I-PULSE CHIP MOUNTER , SMT MACHINE

Robo-Tek

http://robo-tek.com/smt.htm

      Products To see the listed manufacture’s various High Speed SMD Placement Machines/Chip Shooters, Flexible/Multi-Functional Mounters, Solder Paste/Screen Printers, Epoxy (Glue /  Chip Shooter MK1C NM-2562C 0.28sec, 100cst, 10 head*2 nozzie,dispenser 1 head*3 nozzle, M size NM-2565C 0.28sec, 100cst, 10 head*2 nozzie,dispenser 1 head 0.14sec, 75+75cst, 12 head ( 5 nozzle ), LL size High Volume, Low Mix SMD Placement Machine / Chip Shooter MSH NM-2576A 0.14sec, 75+75cst, 10 head ( 3 nozzle ), M size NM-2578 0.14sec, 75+75cst, 10 head ( 3 nozzle ), LL size MSHG1 NM-2576C /  Chip Shooter MVIIE / MV2E     MVIIF / MV2F NM-2558FA/FB 0.1sec, 75+75cst, 12 head ( 5 nozzle ), 1PC system ( option ) MVIIF / MV2F SIMM   0.16sec, ( 22500 cph ), 30+30 MVIIV / MV2V NM-HA00A/10A : 50*50 to 330*250mm. NM-HD15 0.08sec, 75+75cst, 16 head ( 6 nozzle), PC board dimension: 50*50 to 510*460mm. HT122   6 nozzle, 18-head rotary system, inceased X-Y table max of 0.066 s/chip (54,500 CPH), 0603 (0201

DONGGUAN KINGSUN TECHNOLOGY CO.,LTD

http://ksunsmt.com/cpxx/info_34.aspx?itemid=693&lcid=127&pid=125

> YAMAHA CHIP MOUNTER > JUKI CHIP MOUNTER > SAMSUNG CHIP MOUNTER > PANASOINC CHIP MOUNTER > SIEMENS CHIP MOUNTER SMT PERIPHERAL EQUIPM > PANASOINC CHIP MOUNT... Panasoinc NPM medium speed chip mounter machine Product Name:Panasoinc NPM medium speedchip mounter machine Product number : NPM Detailed product introduction: When the head is mounted with a 16 suctionnozzle, the mounting speed is 70000 CPH (0.051 s/ chip). NPM placement machine has 12 suction nozzlehead can be affixed to the head with a range of components is 0402 chip -L12 *W12 * T6.5, the speed is 0.058s/QFP, 62500CPH. NPM placement machine has 8 suction nozzlehead can be affixed to the head with a range of components is 0402 chip -L32 *W32 * T12, the speed is 0.09s/QFP, 40000CPH NPM placement machine has 2 suction nozzlehead can be affixed to the head with a range of components is 0603 chip -L100 *W90 * T28, speed

DONGGUAN KINGSUN TECHNOLOGY CO.,LTD

http://ksunsmt.com/cpxx/info_34.aspx?itemid=732&lcid=129&pid=125

> YAMAHA CHIP MOUNTER > JUKI CHIP MOUNTER > SAMSUNG CHIP MOUNTER > PANASOINC CHIP MOUNTER > SIEMENS CHIP MOUNTER SMT PERIPHERAL EQUIPM > JUKI CHIP MOUNTER RX 7JUKI high-speed module chip mounter Product name: RX 7 JUKI  high-speed module chipmounter Product number: RX - 7 Detailed product introduction Characteristic With high productivity, versatility, highquality new modular placement machine RX 7 listed Component placement speed (best conditions ): 75000 CPH chip components Element size: 0402 (1005) chip ~ - 25 mmsquare elements P16, suction nozzle head realized with tinycomponents of high speed, high density mount P8, suction nozzle head so far achieved insmall and medium-sized general components according to the production line With unique planet head parallel doublepost opening structure to achieve high performance Can correspond to the SMT chip 0402 : 50 * 50 ~ 360 mm * 360mm Element height: 3 mm 3 ㎜ : (P16) suctionnozzle head 10.5 ㎜ : (P8) suctionnozzle head Element size: 0402 (01005) inch chip squareelement 0402

BGA Rework Stations – Precision PCB Services, Inc.

https://precision-pcb-services-inc.com/collections/bga-rework-stations

Chip Off Chip Off Equipment Chip Off Equipment Services Chip Off Machines Chip-Off Equipment for Digital Forensics crcuit board assembly Data Recovery Data recovery equipment Data recovery machines Data recovery services Digital Forensics Forensic Cell Phone Chip Off Machine Forensics Hand Solder Certification Hot Air Rework Infrared Reflow Oven Lead Free Manncorp Nitrogen pcb assembly PCB Repair $17,260.00 BGA Rework Machine - Chip Off-600 $7,500.00 BGA Rework Machine - Model SV550 $17,260.00 BGA Rework Machine - Model SV560 $19,260.00 BGA Rework Machine - Model SV560 -A $24,060.00 BGA Rework Station for Contract Manufacturers - Model E6250U $40,950.00 Chip-Off Equipment for Digital Forensics Model 600 $7,500.00 Chip-Off Equipment for Digital Forensics Model 620 & BGA Rework Station, Chip Off-600 $7,500.00 SMD & BGA Rework Station, Chip Off-620 $9,500.00 Latest News Our August Newsletter is out

Chip-Off Equipment for Digital Forensics Model 600 – Precision PCB Services, Inc.

https://precision-pcb-services-inc.com/products/chip-off-machine

Chip-Off Equipment for Digital Forensics Model 600 – Precision PCB Services, Inc. Search Log in or Create account Cart : 0 Menu Cart 0 Home Catalog Blog About us Log in Create account Search Precision PCB Services, Inc . Home Catalog Blog About us Home › Chip-Off Equipment for Digital Forensics Model 600 Chip-Off Equipment for Digital Forensics Model 600 $7,500.00 Default Title - $7,500.00 USD Quantity Add to Cart Call (888) 406-2830 for answers to your questions. Digital Forensics  Cell Phone Hot Air Chip Off Machine . The vision system features standard resolution optical focus, zoom in/out, micro-adjust, an aberration detection device; with auto focus. Chip Off-600 BGA Chip-Off Machine Features . Chip-off process training is also available for an additional fee.   Share 0 Share on Facebook Tweet Tweet on Twitter Pin it 0 Pin on Pinterest Fancy Add to Fancy +1

ACI Technologies, Inc

https://store.aciusa.org/courses/chip_scale_manf.pdf

. This course will allow students to make informed decisions about advanced packaging technologies (flip chips, chip scale packages, wire bonding, micro BGAs and BGAs • Basic overview of die fabrication and chip scale packages • Inspection technologies • Production implementation of flip chip and chip scale processes, including BGA and micro BGA • Rework processes . Identify and perform critical process steps when manufacturing BGAs, micro BGAs, flip chips and chip scale packages. Learn to identify and implement process control methods and practices when manufacturing assemblies with advanced packages Duration, Registration and Pricing Contact the training center via any of the methods provided below for pricing of this three-day course. Chip Scale Manufacturing Electronics Manufacturing Skills Training ACI Technologies, Inc. • phone: 610.362.1200 • web

Electronics Manufacturing Training - Chip Scale Manufacturing

https://store.aciusa.org/Chip-Scale-Manufacturing--P79.aspx

Electronics Manufacturing Training - Chip Scale Manufacturing Login Account Wishlist Cart Toggle navigation Account Home Product Finder Advanced Search Contact Us Login Home  >  Training Center  >  Skills Based Training Chip Scale Manufacturing Other products by ACI Technologies Available Discounts Quantity Discounts for Training buy 5 to 20, save 25 . This course will allow students to make informed decisions about advanced packaging technologies (flip chips, chip scale packages, wire bonding, micro BGAs and BGAs : Basic overview of die fabrication and chip scale packages Inspection technologies Production implementation of flip chip and chip scale processes, including BGA and micro BGA Rework processes :  Receive hands-on training on advanced packaging equipment located at the ACI demonstration factory. Identify and perform critical process steps when manufacturing BGAs, micro BGAs, flip chips and chip scale packages

Keynote Speaker | SMTA South East Asia

https://www.smta.org/southeast-asia/keynotes.cfm

Keynote Speaker | SMTA South East Asia Menu + Conference Program Keynote Exhibition Logistics smta.org Keynote Speaker Recent Advances in Flip Chip, WLCSP, and FOWLP Wednesday, August 15th John H. Lau, Ph.D ., ASM Pacific Technology Recent advances in (1) flip chip such as wafer bumping, package substrate, assembly, and underfill, (2) fan-in WLCSP (wafer-level chip scale package ) such as relaxation layer and under-bump metallurgy (UBM)-free WLCSP, and (3) FOWLP (fan-out wafer-level packaging) such as chip-first with die face-down, chip-first with die face-up, and chip-last or redistribution layer (RDL

South East Asia Technical Conference on Electronics Assembly | SMTA South East Asia

https://www.smta.org/southeast-asia/

. The conference is "claimable from HRDF under SBL scheme ."   View the Technical Program Here!   Keynote Speaker Recent Advances in Flip Chip, WLCSP, and FOWLP Wednesday, August 15th John H. Lau, Ph.D ., ASM Pacific Technology Recent advances in (1) flip chip such as wafer bumping, package substrate, assembly, and underfill, (2) fan-in WLCSP (wafer-level chip scale package ) such as relaxation layer and under-bump metallurgy (UBM)-free WLCSP, and (3) FOWLP (fan-out wafer-level packaging) such as chip-first with die face-down, chip-first with die face-up, and chip-last or redistribution layer (RDL .   Professional Development Courses   Flip Chip, WLCSP, and FOWLP Assembly and Reliability Tuesday, August 14 John Lau, Ph.D. Sr. Technical Advisor,  ASM The major trend in the electronic industry today is to make products such as smartphones, tablets, wearables, internet of things, etc . Some of the key technologies that are helping to make these cool product design goals possible are flip chip, WLCSP (wafer-level chip scale package), and FOWLP

Panasonic MSF-XL Chip Shooters | Used PBC/SMT… | LEL International

https://www.wearelel.com/semi/buy/pcb-smt-assembly/panasonic-msf-xl-chip-shooters

Panasonic MSF-XL Chip Shooters | Used PBC/SMT… | LEL International LEL semi HOME LEL DECOM LEL CRITICAL LEL SEMI About LEL Inventory PCB/SMT Assembly Equipment Semiconductor Processing Equipment Automated Test Equipment Lab > PCB/SMT Assembly Equipment > Panasonic MSF-XL Chip Shooters Panasonic MSF-XL Chip Shooters Inquire Status sold Share: Year 2005 Manufacturer Panasonic Model MSF-XL NM-MD35 Notes Panasonic Chip Shooters (Quantity 2) Vintage: 2005 Model ID: MSF-XL Model No: NM-MD35 Power Fuji CP-65 Chip Shooter (2000) PCB/SMT Assembly Equipment Yestech YTV-F1 AOI (2008) PCB/SMT Assembly Equipment 2011 DEK Photon View All PCB/SMT Assembly Equipment Learn More Driving Technology Through Quality Equipment Learn More All Semi Categories PCB/SMT Assembly Equipment Cleaning Conveyors . Product Inquiry Thank you for contacting us. We will respond shortly. First Name * Last Name * Email * Company Phone * Description Panasonic MSF-XL Chip Shooters - Subscribe to Mailing List Please check the form and try again.

Fuji CP-65 Chip Shooter (2000) - In Stock & Ready… | LEL International

https://www.wearelel.com/semi/buy/pcb-smt-assembly/fuji-cp-65-chip-shooter-2000

Fuji CP-65 Chip Shooter (2000) - In Stock & Ready… | LEL International LEL semi HOME LEL DECOM LEL CRITICAL LEL SEMI About LEL Inventory PCB/SMT Assembly Equipment Semiconductor Processing Equipment Automated Test Equipment Lab > PCB/SMT Assembly Equipment > Fuji CP-65 Chip Shooter (2000) Fuji CP-65 Chip Shooter (2000) Inquire Status Available Share: Year 2000 Manufacturer Fuji Model CP-65 Lot Number B Notes Fuji CP-65 Chip Shooter Still In-Line . Product Inquiry Thank you for contacting us. We will respond shortly. First Name * Last Name * Email * Company Phone * Description Fuji CP-65 Chip Shooter (2000

EMS_Metcal.qxp

https://www.okinternational.com/File%20Library/Metcal/Resources/White%20Papers/EMS_Metcal.pdf

. Two main challenges await those faced with reworking PCBs populated with these miniature chip components and attempting to remove the chips . Typically, operators work with a sol- dering iron fitted with an extremely small soldering tip, trying to access the solder holding the chip . This approach can introduce the effects of thermal shock. The soldering iron is typically set at +360°C. Unfortunately, chip components are usually specified for a maximum temperature of +260 . Another main challenge facing those trying to rework PCBs with miniature chip components is to achieve the correct solder volume to meet IPC standards, notably when solder should not remain on the top of a chip connection. Unfortunately, this can result from the use of conventional sol- dering tips. Fortunately, a novel approach to soldering has been developed to enable operators to rework PCBs with such miniature components while still maintaining performance, reliability, and repeat- ability

EMS_Metcal.qxp

http://www.okinternational.com/File%20Library/Metcal/Resources/White%20Papers/EMS_Metcal.pdf

. Two main challenges await those faced with reworking PCBs populated with these miniature chip components and attempting to remove the chips . Typically, operators work with a sol- dering iron fitted with an extremely small soldering tip, trying to access the solder holding the chip . This approach can introduce the effects of thermal shock. The soldering iron is typically set at +360°C. Unfortunately, chip components are usually specified for a maximum temperature of +260 . Another main challenge facing those trying to rework PCBs with miniature chip components is to achieve the correct solder volume to meet IPC standards, notably when solder should not remain on the top of a chip connection. Unfortunately, this can result from the use of conventional sol- dering tips. Fortunately, a novel approach to soldering has been developed to enable operators to rework PCBs with such miniature components while still maintaining performance, reliability, and repeat- ability

Paquetes de Chip Invertido - ZESTRON Americas

http://www.zestron.com/esp/aplicaciones/limpieza-de-modulos-de-potencia-y-paquetes-electronicos/paquetes-de-chip-invertido.html

Paquetes de Chip Invertido - ZESTRON Americas Contáctanos Solicita SDS english - Americas english - Europe english - South Asia spanish - Americas deutsch français 中文 日本語 한국어 русский VIGON Módulos de Potencia Leadframes LEDs de Potencia Paquetes de Chip Invertido Limpieza de CMOS Limpieza de BGA Limpieza de MRR Limpieza MRR Limpieza de Piezas de Módulos de Potencia y Paquetes Electrónicos       Paquetes de Chip Invertido Paquetes Flip Chip Los tipos de componentes como FCBGA, FCmBGA y micro-FCBGA, los contactos eléctricos (bordes ) son soldados en la base del componente utilizando una combinación de chip invertido y estructuras BGA  en un proceso de reflujo. Para el proceso de die attach durante la fabricación del chip invertido se requiere de  pastas de flux (Tacky flux) que  se aplican vía  dispensador, rociado o en un proceso de inmersión de chip. La remoción de todos los residuos de flux de los espacios estrechos entre el chip invertido y el material de la base es requerida para poder lograr un humedecimiento completo y libre de huecos de todo el

Flip Chip Packages - ZESTRON Americas

http://www.zestron.com/us/applications/power-electronics-and-packages/flip-chip-packages.html

Flip Chip Packages - ZESTRON Americas Contact us SDS Request english - Americas english - Europe english - South Asia spanish - Americas deutsch français 中文 日本語 한국어 русский Maintenance Cleaning Power Electronics and Packages Power Modules Leadframes Power LEDs Flip Chip Packages CMOS BGAs MRO MRO Cleaning Precision Parts Cleaning Cleaning Processes Spray-in-air Dip Tank History Virtual Tour Corporate Responsibility Career Opportunities Home       APPLICATIONS       Power Electronics and Packages       Flip Chip Packages Flip Chip Packages Component types such as FCBGA, FCmBGA, and micro-FCBGA, the electrical contacts (bumps ) are soldered onto the component base utilize a combination of Flip Chip and BGA structures whereas using a reflow process.  For the die attach process during Flip Chip manufacturing, flux pastes (tacky fluxes ) are required and applied via a dispenser, spraying or a chip dip process.  The removal of all flux residues from the tight spaces between the Flip Chip and the base material is required in order to achieve a complete and void free wetting of all materials for the underfill process

Panasonic HDP Chip Glue Dispensing Nozzle 2D2S Chip Nozzle for 1608mm Component

http://www.smtspare-parts.com/sale-9401138-panasonic-hdp-chip-glue-dispensing-nozzle-2d2s-chip-nozzle-for-1608mm-component.html

Panasonic HDP Chip Glue Dispensing Nozzle 2D2S Chip Nozzle for 1608mm Component Professional Supplier Of SMT Spare Part , as Feeder, Nozzle, Filter, Motor, Laser, etc Polish Home Products About Us Factory Tour Quality Control Contact Us Request A Quote Home Products SMT Nozzle Panasonic HDP Chip Glue Dispensing Nozzle 2D2S Chip Nozzle for 1608mm Component All Products SMT Spare Parts (211) SMT Feeder (73) SMT Feeder Parts (168) SMT Nozzle (141) SMC Air Cylinder (32 . Erica C Lagarry Business Flourishes! Products Large Stocks, Parts Authentic,Delivery Fast, Price Reasonable! —— Ms. Vicki I'm Online Chat Now Panasonic HDP Chip Glue Dispensing Nozzle 2D2S Chip Nozzle for 1608mm Component Large Image :  Panasonic HDP Chip Glue Dispensing Nozzle 2D2S Chip Nozzle for 1608mm Component Product Details: Place of Origin: China Brand Name: Panasonic Model Number : 1000pcs Contact Now Chat Now Detailed Product Description Brand: Panasonic Machine Model: HDP Component: 1608mm Part Name: Chip Glue Dispensing Nozzle Part Number

Panasonic HDP Chip Glue Dispensing Nozzle 2D2S Chip Nozzle for 1608mm Component

https://www.smtspare-parts.com/sale-9401138-panasonic-hdp-chip-glue-dispensing-nozzle-2d2s-chip-nozzle-for-1608mm-component.html

Panasonic HDP Chip Glue Dispensing Nozzle 2D2S Chip Nozzle for 1608mm Component Professional Supplier Of SMT Spare Part , as Feeder, Nozzle, Filter, Motor, Laser, etc Polish Home Products About Us Factory Tour Quality Control Contact Us Request A Quote Home Products SMT Nozzle Panasonic HDP Chip Glue Dispensing Nozzle 2D2S Chip Nozzle for 1608mm Component All Products SMT Spare Parts (225) SMT Feeder (73) SMT Feeder Parts (175) SMT Nozzle (149) SMC Air Cylinder (36 . Erica C Lagarry Business Flourishes! Products Large Stocks, Parts Authentic,Delivery Fast, Price Reasonable! —— Ms. Vicki I'm Online Chat Now Panasonic HDP Chip Glue Dispensing Nozzle 2D2S Chip Nozzle for 1608mm Component Large Image :  Panasonic HDP Chip Glue Dispensing Nozzle 2D2S Chip Nozzle for 1608mm Component Product Details: Place of Origin: China Brand Name: Panasonic Model Number : 1000pcs Contact Now Chat Now Detailed Product Description Brand: Panasonic Machine Model: HDP Component: 1608mm Part Name: Chip Glue Dispensing Nozzle Part Number

Upgrading Software for PCD Tabletop Controller

http://www.gpd-global.com/co_website/pdf/doc/PCD-Tabletop-Controller-Software-Upgrade-2200-0297S.pdf

. Format the chip card per Formatting Memory Card in PCD Tabletop Controller User Guide (PN 2200-0297M). 2. Install Software GrTerm 202 on your PC. 3 . 12. After new program update, chip card has to be initialized: a. Switch on PCD Tabletop Controller. b. Press Start and PRG at the same time. c. Chip card state (initialized and OK . During the upgrade, the chip card must be reformatted; this action erases all existing programs. Any files saved from the chip card prior to formatting exist in the old file system and will not function in the new file system

XYZ Calibration - Needle Calibration Station

http://www.gpd-global.com/co_website/pdf/dispense/XYZ-Calibration-Station.pdf

. The system will dispense dots on the ceramic chip in a matrix pattern. Once the matrix has filled the ceramic chip, the system will notify the operator that it is time to clean or replace the chip

Learn About Kyzen’s Advanced Packaging Cleaning Chemistry for Flip Chip and Low Clearance Components

https://www.kyzen.com/main-pages/learn-about-kyzens-advanced-packaging-cleaning-chemistry-for-flip-chip-and-low-clearance-components/

Learn About Kyzen’s Advanced Packaging Cleaning Chemistry for Flip Chip and Low Clearance Components | Kyzen: Eco-Friendly Cleaning Products, Industrial Cleaning Solutions English English English About Us KYZEN Difference Leadership News Events Associations Compliance What is science without care Kyzen’s Advanced Packaging Cleaning Chemistry for Flip Chip and Low Clearance Components Learn About Kyzen’s Advanced Packaging Cleaning Chemistry for Flip Chip and Low Clearance Components Learn About Kyzen’s Advanced Packaging Cleaning Chemistry for Flip Chip and Low Clearance Components at SEMICON West NASHVILLE — June 10, 2013 — Kyzen will showcase AQUANOX ® A4638 removes flux residue from flip chip and low clearance components. A4638 rapidly removes water soluble polar flux residues and exhibits a low surface tension

Learn About Kyzen’s Advanced Packaging Cleaning Chemistry for Flip Chip and Low Clearance Components

https://www.kyzen.com/main-pages/learn-about-kyzens-advanced-packaging-cleaning-chemistry-for-flip-chip-and-low-clearance-components/?option=com_content&task=view&id=377&Itemid=197

Learn About Kyzen’s Advanced Packaging Cleaning Chemistry for Flip Chip and Low Clearance Components | Kyzen: Eco-Friendly Cleaning Products, Industrial Cleaning Solutions English English English About Us KYZEN Difference Leadership News Events Associations Compliance What is science without care Kyzen’s Advanced Packaging Cleaning Chemistry for Flip Chip and Low Clearance Components Learn About Kyzen’s Advanced Packaging Cleaning Chemistry for Flip Chip and Low Clearance Components Learn About Kyzen’s Advanced Packaging Cleaning Chemistry for Flip Chip and Low Clearance Components at SEMICON West NASHVILLE — June 10, 2013 — Kyzen will showcase AQUANOX ® A4638 removes flux residue from flip chip and low clearance components. A4638 rapidly removes water soluble polar flux residues and exhibits a low surface tension

Reducing CTE Mismatch Defects in Flip Chip Reflow | BTU

https://www.btu.com/document/reducing-cte-mismatch-defects-in-flip-chip-reflow/

 Reducing CTE Mismatch Defects in Flip Chip Reflow | BTU Home Contact Us Parts Locator Search for: Menu Why BTU Products Reflow Ovens Pyramax Pyramax Vacuum Pyramax TrueFlat Pyramax ZeroTurn Dual Chamber Reflow Oven Aqua Scrub Flux Management Advanced Technologies Custom Furnaces Controlled & Events Press Releases Events In the News Careers Career Opportunities Benefits Reducing CTE Mismatch Defects in Flip Chip Reflow Reflow Ovens Pyramax Pyramax Vacuum Pyramax TrueFlat Pyramax ZeroTurn 4.0 Energy Pilot RecipePro Profile Guardian Upgrades Reducing CTE Mismatch Defects in Flip Chip Reflow US Tech – May 2019 – In this article Thomas Tong and co-authors explain the use of the TrueFlat reflow oven technology to keep very thin substrates flat during reflow . This is an important consideration for flip chip processes where CTE mismatch is an inherent process challenge. Type: application/pdf Size: (418.9 KB) Download Learn more about substrate flatness during reflow This paper provides an overview of the need for and use of flatness techniques to reduce bowing during the thermal processing of very thin substrates.   Specifically, this application covers flip chip reflow using a Pyramax Trueflat reflow oven.  The authors also highlight the controlled cooling and the affects of suction uniformity on thermal uniformity. Download now

Knowledge Center of Our Thermal Processing Expertise | BTU

https://www.btu.com/about-us/knowledge-center/

& ARTICLES Reducing CTE Mismatch Defects in Flip Chip Reflow (418.9 KB) US Tech - May 2019 - In this article Thomas Tong and co-authors explain the use of the TrueFlat reflow oven technology to keep very thin substrates flat during reflow . This is an important consideration for flip chip processes where CTE mismatch is an inherent process challenge. Operation of a Vacuum Reflow Oven (1.2 MB ., uses a standarized cost of ownership analysis to compare in-line diffusion with batch processing. Wafer Level Packaging (2.9 MB) SECAP - 2005 --- A collection of papers on wafer level packaging and flip chip bumping covering a range of topics including plating, UBM, photolithography, and lead-free processing

http://seikausa.com/sites/default/files/documents/McDry%20LED%20Flyer.pdf

(W eig ht % )  Chip LED stored in ambient environment (30°C, 60% RH) for 168 hours.  After 11 hours of storage in this environment, it was left for 13 hours in a dry box at <3% RH . This process was repeated 5 times from Monday to Friday and left for 61 hours in a dry box at <3% RH.  After baking, the LED chip was stored in a dry cabinet capable of maintaining 3%RH . (This is a similar condition with an LED chip that is stored in a dry cabinet right after opening a moisture barrier bag.) Left Unattended Monday 8amMonday 8am Stored DXU-580, 1

Microsoft PowerPoint - Sawa SC-AH100F-LV Presentation.ppt [Compatibility Mode]

http://seikausa.com/sites/default/files/documents/sawa-sc-ah100F-lv-presentation.pdf

. Ultrasonic energy is applied directly to the stencil providing superior cleaning capability. Cleaning Evaluation QFP 0.4㎜ Flip chip bump φ0.2㎜ 0402(01005) QFP 0.4㎜ Flip chip bump φ0.2㎜ 0402(01005) Before Cleaning After Cleaning Squeegee/spatula cleaner can be connected as an option

Specifications

https://essemtec.com/fileadmin/user_upload/produkt/pdf/DE/FOX_Specifications_V3.1.pdf

) Optimum placement speed Chip 7 cph Speed (IPC 9850) Chip cph QFP Chip cph QFP cph Chip cph QFP Speed (IPC 9850A) Chip 5 900 cph QFP 4 500 cph Chip 300 cph QFP 4 500 cph Chip 15 000 cph QFP 5 600 cph Dispensing speed up to Jet valve (fiducials, chip, QFP, asymm. BGA and leads)       Multi Field of View license (MFOV)       Vision Box for 80x80mm components

Specifications

https://essemtec.com/fileadmin/user_upload/produkt/pdf/DE/FOX_Spezifikation_DE_V3.1.pdf

) Optimale Geschwindigkeit Chip BE/h BE/h BE/h Geschwindigkeit (IPC 9850) BE/h BE/h BE/h BE/h BE/h BE/h Geschwindigkeit (IPC 9850A) Chi Dispensgeschwindigkeit Pkt       Technische Support Software       Optische Zentrierung Cognex SMD4 PatMax Vision Lizenz (Marken- erkennung, Chip, QFP, asymm. BGA und leads)       Multi Gesichtsfeld Lizenz

Press Releases

http://mirtecusa.com/news-pressreleases-2015-semiWest.php

. Alternatively, with a flip chip technology, solder bumps are used to join stacked chips together. As one can imagine, this complex arrangement of advanced packaging presents a challenge to the inspection environment.” MIRTEC’s MP-520 :   - Solder Ball/Bump – Presence, Pitch, Offset, Height, Co-Planarity and Bridging - Bond Wire - Short, Broken, Shift and Loop Height - Chip Bond - Offset, Height, Crack and Chip - Discrete Device

Press Releases

http://mirtecusa.com/news-pressreleases-gtaaward2013.php

. Automated Optical Inspection is required at two different stages within the LED packaging process. In the first stage the bond wire, chip die and stitch balls are inspected for defects prior to encapsulation . The system features a Super High Resolution 5 micron per pixel Precision Compound Telecentric Lens and a High Intensity Blue LED Lighting System to perform precision bond wire, chip die and stitch ball inspection

IPC 7711 | IPC 7721 Certified IPC Trainer (CIT) Course at BEST Inc

https://www.solder.net/training-courses/ipc-7711-21-cit-training/

: conductive, convective, etc. Handling electronic assemblies Wire splicing procedures Through hole component removal and installation Chip and MELF rework procedures SOIC/SOT, J-lead and QFP rework Printed wiring board circuit , Fine Pitch, and Chip Component rework and replacement proficiently - Perform conformal coating removal, laminate repair, pad and trace repair, and place/mount modification wire - Proficiently conduct IPC 7711 Chip Procedures SMT Chip Demonstration and Lab SOIC/SOT Procedures SOIC/SOC Demonstration and Lab LCCC/BGA Procedures DAY 3 QFP/J-Lead Procedures QFP/J-Lead Demonstratoin and Lab Conformal Coating Repair Procedures Laminate Repair Demonstration and Lab DAY 5 Open (make-up) Lab Comprehensive Review Open and Closed Book Exams Review Exams Roles and Responsibilities of IPC Registered Instructors Components covered in the training: Through-Hole                 Chip & MELF                 SOT

IPC 7711 Certified Training | IPC Specialist (CIS) Course at BEST Inc.

https://www.solder.net/training/courses/ipc-7711-cis-training

. These include but are limited to the following: Demonstrate recommended wire splicing techniques Remove and replace Plated Through Hole components Remove and replace Chip SMT components using a variety of methods Remove and replace J-lead SMT as bottom heater and hot air removal system. COURSE OBJECTIVE - Demonstrate recommended wire-splicing techniques - Remove and replace plated through-hole components - Remove and replace chip and MELF SMT components - SOIC Gull Wing and SOT SMT ) MODULE 3 - Conformal Coating (Optional) MODULE 4 - Through-Hole Technology (Optional) MODULE 5 - Chip and MELF Components (Optional) MODULE 6 - Gull Wing Components - SOTC, SOIC, D-PAK, QFP (Optional) MODULE 7 - J-Lead Components (Optional) Components covered in the training: Through-Hole              Chip & MELF                 SOT and SOIC - 1/4 Watt Resistor    - 1206 Resistor

Wave Solder | Lead Free Wave Solder

http://alpha1technologies.com/wave-solder/

& printing abilities Lengthened pre-heaters in 3 sectors, unbreakable glass covers, convenient for operation & maintenance Intelligent fault alert system, on-line display and record all system errors Adjustable wave height for Chip & fully automatic system on/off timer Series 3A and 3B Wave Solder Brochure   S1825M Compact Soldering Machine S1825M   Low cost Mitsubishi PLC 800mm preheat Automatic spray fluxer Simple design for easy maintenance Adjustable wave height for chip

http://alpha1technologies.com/wp-content/uploads/2017/06/Series-3A-and-3B-Wave-Solder.pdf

 Adjustable wave height for Chip & lambda independently  Featured with intermittent wave, reduce of solder dross formation  Visual & audio alert, emergency shutdown, overloading protection to motors  Programmable & fully automatic system on/off timer Solder Pot comes with Chip and Lambda Wave with the option of either Titanium or Ceramic Coated Cast Iron %, Cast Iron W/Ceramic Coating Wave Height 0-12mm Wave Nozzle Displacement Between Chip & Lambda 50mm Lambda Wave Displacement 40-80mm Wave Motors Rotation 1450rpm Pot Rolling In/Out Manual, Motorized or Computer Controlled (optional) Dross Amount 0.19

Underwater Drone Project Competition- Sponsor - PCBWay

https://www.pcbway.com/project/sponsor/Robotics_Motor_Controller_and_Sensor_Board.html

competitors in the 2018 MATE international competition within the first year of operation. OUR BOARDS ESC MOTOR CONTROLLER BOARD The board uses the ATMEGA2060 chip with the Arduino ISP Programmer to communicate with the Bl_Heli 32 BLSC ESC controller .  SMART SENSOR BOARD The sensor board uses the ATMEGA328P chip with the Arduino ISP Programmer to display information regarding temperature, pressure, and gyroscope . You can also add more sensors thanks to the extra pins on the chip.  Apply for sponsorship >> 524 Projects Sponsored Posted in Robotics , robotics motor controller sensor board Aug 14,2018 717 views Report item Comments ( 0 ) Likes ( 5

Sumo Robot Card- Sponsor - PCBWay

https://www.pcbway.com/project/sponsor/Sumo_Robot_Card.html

) WERY IMPORTANT - crystal layout. DC motor are make a lot of noice in power rail. You nead GNG poligon under Atmega chip, It should have only ONE wire connection to power GND. http://ww1

Manufacturing Process Consulting | Precision PCB Services

https://www.pcb-repair.com/services/manufacturing-process-consulting/

E6250U BGA Rework Station BGA Rework Station Optional Features Nitrogen Capable Side View Camera Cabinet Base on Wheels BGA Rework Stations for Phones Chip Off Machines Hot Air Rework Station . We specialize in areas such as: BGA LGA PoP Chip Scale QFN Defect Anomalies Lead-Free Process Lead-Free High-Tech Packaging Solutions And more ! Types of PCB Services We Offer Precision PCB Services Inc. offers many services to increase your PCB process efficiency. We are an established expert in BGA rework and are a source reference for the Xilinx Document XAPP426, "Implementing Xilinx Flip-Chip BGA Packages

Introduction to Integrated Circuits SMD Packages - PCB Assembly,PCB Manufacturing,PCB design - OURPC

https://www.ourpcb.com/ic-smd.html

. Flat Chip Package MELF MOLDED Tantalum SOT Flat Chip Packages  are most commonly used and they have two units of measurement. Metric and Inch. The code is a 4 digit number suppose 0402, 04 0.5mm leads for 20 to 56 leads and 1.27mm pitch for 20 leads package Plastic Lead Chip Carrier PLCC has J-Lead with 50mil 1.27mm pitch. Available in 18-100 leads . Also they are available in ceramic CLCC and metal MLCC packages. They can be fit inside the socket. LCC Leadless Chip Carriers have no leads and are soldered directly on PCB through their solder pads

Surface Mount-Types of SMD(Surface Mount Device) Packages

https://www.ourpcb.com/surface-mount-2.html

. Leadless Ceramic Chip Carriers (LCCC): LCCC have gold plated, groove-shaped terminations known as castellation that provide shorter signal paths allowing higher operating frequencies . The LCCCs can be divided into different families depending on the pitch of the package. The most common is 50 mil ceramic leaded chip carrier families

3D Automated X-ray Inspection Systems - Saki Products

https://www.sakiglobal.com/automated-x-ray-inspection-axi-3d-products.html

. It is the ideal inspection platform for various test applications, including a wide range of solutions for non-destructive testing (NDT). Its customized solutions can be used in the semiconductor industry to inspect electronic components and solder in applications such as flip chip attachment, laser through-hole (LTH ) Chip scale packages (CSPs) Chip type parts Connectors Diodes Land grid array (LGA) Module chips Power transistors Quad flat no-leads (QFN) Quad flat packs (QFPs

True 3D X-ray Vision Inspection Systems - Saki America

https://www.sakiglobal.com/automated-x-ray-inspection-axi.html

) module Semiconductor High resolution inspection (defect inspection down to 15μm) Void inspection of laser through-holes (LTH) Flip chip bonding inspection Package-on-package (PoP ) Chip scale packages (CSPs) Chip type parts Connectors Diodes Land grid array (LGA) Module chips Power transistors Quad flat no-leads (QFN) Quad flat packs (QFPs

Pressure curing vs Vacuum bake

http://www.hellerindustries.com/search.php?zoom_query=Pressure+curing+vs+Vacuum+bake&zoom_page=25&zoom_per_page=10&zoom_and=0&zoom_sort=2

://www.hellerindustries.com/supplier-partnership-benefits.pdf Inline- Vacuum -Reflow-System.pdf ... improve chip performance in high frequency applications n Void Reduction Reflow Technique 1 Vacuum assisted reflow Vacuum Assisted Reflow n Vacuum-assisted reflow has been shown to reduce the voids . Trapped gas bubbles increase in size as pressure is reduced Larger bubbles are ... current density increases with voiding) n Improve long-term stability and reliability of solder joint against heat dissipation and vibration/shock n May improve chip performance in high frequency applications n Void Reduction Reflow

david

http://www.hellerindustries.com/search.php?zoom_query=david&zoom_page=2&zoom_per_page=10&zoom_and=0&zoom_sort=0

." said David Heller, CEO of Heller Industries." The gaseous fluxing process may become instrumental in helping our customers develop their next generation chip packaging ." said David Heller, CEO of Heller Industries. "The gaseous fluxing process may become instrumental in helping our customers develop their next generation chip packaging technologies

BGA Rework Tacky Paste Flux - Qualitek

https://qualitek.com/bga-rework-tacky-paste-flux/

:00 BGA Rework Tacky Paste Flux Paste Flux Tacky Flux Qualitek paste flux is a combination of tackifier and fluxing agent specially formulated for touch-up soldering, BGA packages and flip chip applications | ROL0 No/Yes PF400 RA Rosin Activated flux paste flux. Best seller. | PF400 TDS | PF400 SDS | ROM1 No/Yes     BGA Rework Tacky Paste Flux Paste Flux Tacky Flux Qualitek paste flux is a combination of tackifier and fluxing agent specially formulated for touch-up soldering, BGA packages and flip chip applications

Microsoft Word - 355-35_LF_TDS_d.doc

https://qualitek.com/wp-content/uploads/2017/06/355-35_LF_TDS.pdf

. Qualitek 355-35 is formulated to remain active after the chip wave, eliminating the formation of solder balls. 355-35 is highly active flux with good through-hole performance ) Contact Time in the Solder (including Chip & Lambda) 2.5-4.5 seconds Solder Pot Temperature 500-530 °F (260-276 °C) Sn96.5/Ag3.5 Sn95/Ag5 536-565 °F (280-296 °C) Sn99.3/Cu0.7 510-530 °F (265-276 °C) SnAgCu 520-530 °F (271-276 °C) Sn95/Sb5 536-565 °F (280-296 °C) TYPICAL Lead Free Wave Solder Profile

Call for Participation: Technical Paper | IPC APEX EXPO 2021

https://www.ipcapexexpo.org/education/call-for-technical-paper-form

- 2.5-D/3-D Packaging Adhesives Advanced Technology Area Array/Flip Chip/0201 Assembly and Rework Processes Automation BGA Packaging Black Pad and Other Board Related Issues BTC/QFN/MLF Business and Test Supply Chain/Business Issues Please choose additional topics (as appropriate) 2.5-D/3-D Packaging 3D Printing in Electronics Manufacturing Adhesives Advanced Technology Area Array/Flip Chip/0201 Assembly and Rework Processes Automation BGA Packaging Black Pad and Other Board

Call for Posters | IPC APEX EXPO 2019

http://www.ipcapexexpo.org/html/present/call-for-posters.htm

: 3D Printing in Electronics Manufacturing Automation in Electronics Manufacturing Adhesives Advanced Technology Area Array/Flip Chip/0201 Metric Assembly and Rework Processes BGA/CSP Packaging Black

Archives for November 2016 | Baja Bid LLC

http://bajabid.com/2016/11/

; Kulicke & Soffa 6900 Flip Chip Bonder; Benchmark SM8000 Seam Sealer; MicroAssembly 6400 Die Attach System; Senju Ecopascal 400 Lead-Free Wave Solder

Archives for May 1st, 2014 | Baja Bid LLC

http://bajabid.com/2014/05/01/

: Finetech Lambda Flip Chip Bonder, Averna Life Test System, Royce DE35-ST Semi-Automatic Die Handler, Royce MP300 Die Sorter, Spirent SPT-2U TestCenter, Test Equity 1007S Temperature Chambers, Agilent

Tech Tools

http://www.nordson.com/en-us/divisions/asymtek/support/Pages/Tech-Tools.aspx

Software Tech Tools Scroll down to find the following technical tools: Flip Chip Calculator, Dam and Fill Analyzer, Cost of Ownership and Findapart . This is the ideal way to identify the part number for spare or replacement parts. Visit the Findapart website Findapart - opens in new window Flip Chip Calculator The Flip Chip Calculator offers a quick and easy way to determine the volume of underfill necessary to optimize flip chip in package and flip chip on board dispensing processes. To utilize the application, the user simply inputs parameters including die proportions, fillet width and solder bump profiles, then selects a specific underfill material from the list of industry . Will not run on 64-bit systems. Flip Chip Calculator (5.3 MB) Dam and Fill Analyzer The Dam and Fill Analyzer provides a quick and easy way to formulate the optimal dispense parameters for any dam and cavity fill dispensing application

Nordson ASYMTEK | Fluid Dispensing Equipment for Printed Circuit Board Assembly and Semiconductor Pa

http://www.nordson.com/en-us/divisions/asymtek/pages/default.aspx

. Life Science Nordson ASYMTEK's products precisely jet, coat and dispense reagents and other fluids during manufacturing operations for medical devices, point-of-care device assembly, lab-on-a-chip

Inspection Mirrors & Milprobes

http://www.beautech.com/newprod.cfm

: Distributors Our Mission Contact Us Proud Sponsor Of:   1 MilProbes for Ultra Fine Pitch Rework - BGA, Flip Chip, TAB, COB, etc. The RocHard 1 MilProbe

Inspection Mirrors & Milprobes

https://www.beautech.com/newprod.cfm

: Distributors Our Mission Contact Us Proud Sponsor Of: 1 MilProbes for Ultra Fine Pitch Rework - BGA, Flip Chip, TAB, COB, etc. The RocHard 1 MilProbe

Unisoft - software assembly documents assembly instructions with costs

http://www.unisoft-cim.com/sample-library_assembly-instructions-with-costs.html

     SKIP - HAND INSTALL - CHIP SHOOTER AUTO INSERT - RESISTOR 4.75K_1/4W_1%     0.04 391770-01-2     Mydata / Mycronic - RESISTOR 6.8K_2%     0.04 391770-02-0     Mydata / Mycronic - RESISTOR 10K_2

Unisoft - software assembly documents assembly instructions with costs

https://www.unisoft-cim.com/sample-library_assembly-instructions-with-costs.html

     SKIP - HAND INSTALL - CHIP SHOOTER AUTO INSERT - RESISTOR 4.75K_1/4W_1%     0.04 391770-01-2     Mydata / Mycronic - RESISTOR 6.8K_2%     0.04 391770-02-0     Mydata / Mycronic - RESISTOR 10K_2

AX Nozzle V3 – IslandSMT

http://islandsmt.com/product/ax-nozzle-v3

: AX Description Additional information Description AX Nozzle V3 for small non-ceramic components (BGA, Flip Chip, etc) Additional information Weight 2 lbs Dimensions 3 × 3

AX Nozzle V3 – IslandSMT

https://islandsmt.com/product/ax-nozzle-v3

: AX Description Additional information Description AX Nozzle V3 for small non-ceramic components (BGA, Flip Chip, etc) Additional information Weight 2 lbs Dimensions 3 × 3

Contact 3Z SMT Placement Machine

http://versatecsolutions.com/3z%20and%203avx%20overview.html

.   The Contact 3AVX The Contact 3AVX place a full range of component types from small chip resistors and capacitors, to large, leaded integrated circuits

Remanufactured Contact Systems C5d SMT Placement Machine (First Generation)

http://versatecsolutions.com/csi_c5d%20old.html

(First Generation) SMD Placement Machine   The C5d is ideal for medium/large volume manufacturers. Unlike most competitive high speed machines, the C5d can place a full range of components, thus it is both a flexible machine and a “chip shooter

S100 New

http://fknsystek.com/8DSK7000.pdf

(ie. ceramic chip capacitors.) 25O Recommended Scoring Depth > .012" < .027" 25O V Score >.3 mm < .7mm Blade Profile FKN Systek Tools For Electronics Assembly Compact PCB Singulator for Close Component Spacing. 381mm 15" 12

S100 New

http://fknsystek.com/8DSK2000.pdf

. Placement of components to edge. > .04" (1mm) for standard components > .08" (2mm) for sensitive components (ie. ceramic chip capacitors

E113481-dip-fluxer-uk.pdf

https://www.europlacer.com/es/special-feeders/?attachment_id=1469&download_file=5b8803bfa3933

europlacer.com 1 D E S C R I P T I O N The Europlacer Rotary Dip Fluxer (E113481) can be used for flip chip placement or PoP applications

E113481-dip-fluxer-uk.pdf

https://www.europlacer.com/it/alimentatori-speciali/?attachment_id=1469&download_file=5b8803bfa3933

europlacer.com 1 D E S C R I P T I O N The Europlacer Rotary Dip Fluxer (E113481) can be used for flip chip placement or PoP applications

Microsoft Word - pan_APEX06.doc

http://www.hellerindustries.com.cn/pan_APEX06.pdf

; and 195oC, 205oC, and 215oC for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors ; and 195oC, 205oC, and 215oC for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors °C above SnPb or SnAgCu solder liquidus temperatures. Four different sizes of pure tin plated chip resistors, 1206, 0805, 0603, and 0402 were used in this experiment was detected in the fracture area. Figure 11. Fracture Area of SnPb Joint Reflowed at 215C for 90 sec. Figure 12. Fracture Area of SAC305 Joint Reflowed at 250C for 90 sec. A typical termination structure of lead-free chip resistor is shown in Figure 13. Since sizes, this may be the reason why the effects of the peak temperature and the TAL are not consistent for different component sizes and for the SnPb and SAC305 joints. Figure 13. Typical Termination Structure of Lead Free Chip Resistor (source: TopLine

2015 Micron KEG Supplier Summit

http://www.hellerindustries.com.cn/pdfs/fluxless-reflow.pdf

.” said David Heller, CEO of Heller Industries. “The gaseous fluxing process may become instrumental in helping our customers develop their next generation chip packaging technologies

PCBL - Library Expert [USER GUIDE]

http://www.pcblibraries.com/Products/FPX/UserGuide/default.asp?ch=1.1

        - Edit Physical Description List         - Check Links         - Find Duplicates Surface Mount Calculators         - BGA         - QFN         - SOT23         - SOT143         - Chip Resistor         - QFN with Chamfered Pads

PCBL - Library Expert [USER GUIDE]

http://www.pcblibraries.com/Products/FPX/UserGuide/default.asp?ch=1.3

        - Edit Physical Description List         - Check Links         - Find Duplicates Surface Mount Calculators         - BGA         - QFN         - SOT23         - SOT143         - Chip Resistor         - QFN with Chamfered Pads

IPC 7711/7721 CIS Recertification - Blackfox.com

https://www.blackfox.com/ipc-certification/ipc-specialist/ipc-77117721-cis-recertification/

. Operators will obtain the knowledge to: State the purpose, scope, schedule, and grading criteria of the re-certification course. State IPC policies that govern operation of 7711/7721 certification and re-certification program Demonstrate Through-Hole, J-lead, Gull-Wing, Fine Pitch, and Chip component rework and replacement

IPC 7711/7721 Certified IPC Specialist - Blackfox.com

https://www.blackfox.com/ipc-certification/ipc-specialist/ipc-77117721-cis/

(Optional) – Through-Hole Rework Module 4 (Optional) – Surface Mount Chip Rework Module 5 (Optional) – Surface Mount Gull Wing Rework Module 6 (Optional

Technician_833 | Retronix Semiconductor

https://retronixsemiconductor.com/job-search/technician_833/

equipment parts to be based in Hillsboro.   The candidate will be responsible for rebuilding and qualifying precision pneumatic/mechanical devices used in machines for semiconductor chip manufacturing

Our 5 favorite semiconductor fabs and foundries | Video list

https://retronixsemiconductor.com/blog/our-5-favorite-semiconductor-fabs-and-foundries/

! Intel Intel have a 50-year legacy of technology innovation that started with the first single chip microprocessor in 1971. A pioneer of advanced manufacturing, Intel are arguably one of the most influential players in semiconductors

Call for Papers | SMTA International

http://smta.org/smtai/call_for_papers.cfm

Testing Failure Analysis Techniques Flip Chip High Temperature Packaging Lead Finishes Magnetic Soldering MEMS and Sensors Moisture Sensitive Devices (MSD Coating and Potting Connector Assembly to PCB DFX/Design for Six Sigma Direct Chip Attach to PCB (DCA) Dispensing & Underfill Epoxy Fluxes Facility Layout Halogen and Halogen-Free Head on Pillow Defect/Warpage Induced Solder Joint Defects High Melting Point Solder Laser Soldering Leadless Area Array Packages Lead

Journal of SMT Articles

http://smta.org/knowledge/journal.cfm

  27-4 Multi-Variable Multi-Objective Design Optimization of BEoL/ fBEoL Structure in a Flip Chip Package during Chip Attachment to Substrate Fahad Mirza, Hardik Parekh, Tejas Shetty, and Dereje Agonafer Purchase   27-2 3-D Fracture Analysis of the BEoL Region of a Flip Chip Package During Die Attach Process Zaeem Baig, Fahad Mirza, Hardik Parekh, Dereje Agonafer Purchase Reinikainen2, Viswam Puligandla Purchase  20-4 0.4 mm SOLDER BALL PITCH CHIP SCALE PACKAGING AND DROP TEST PERFORMANCE Geun Sik Kim and Dong Sik Kim Purchase  20-4 AN EXPERIMENTAL STUDY OF A COMPONENTS TERMINATION FINISH CONVERSION PROCESS: THE ROBOTIC STRIPPING AND SOLDER DIPPING PROCESS G. Subbarayan and R. Kinyanjui, J. Deutsch and M. Purchase  20-3 ULTRASONIC GOLD TO GOLD FLIP CHIP INTERCONNECT PROCESS USING LOW COST SUBSTRATES Philip Couts and M. Kawahara Purchase  20-3 CONSIDERATIONS IN SELECTING FLUXES FOR LEAD OF ACTIVE AND PASSIVE COMPONENTS USING CHIP IN POLYMER TECHNOLOGY Lars Boettcher, A. Neumann, A. Ostmann and H. Reichl Purchase  19-2 MODEL BASED APPROACHES FOR SELECTING RELIABLE UNDERFILL-FLUX COMBINATIONS FOR FLIP CHIP PACKAGES Satyanarayan Iyer, Nagendra

BGA Thermal Shock Testing

http://www.soldertools.net/product_images/stencilquik/papers/SelectSolderPasteDeposit.pdf

Guide, Motorola 2003. [ 2 ] CBGA Surface Mount Assembly and Rework User’s Guide, IBM 2002. [ 3 ] “Chip Scale Package Rework Considerations: Using Solder vs Gel Flux”, Paul Wood , Intel Application Series, 2002. [ 4 ] “Solder Ball Endurance”, Terence Collier, Advanced Packaging, September 2003 [ 5 ] “Flip-Chip / CSP Assemby Reliability and Solder Volume Effects”, Jean-Paul Clech, SMI Conference Proceedings, pp 315-324. [ 6 ] “Solder joint Reliability of Sn-Ag-Cu BGA Components Attached with Eutectic PB , January 1999. [ 8 ] “Investigation of the Manufacturing Challenges of 2577 I/O Flip Chip Ball Grid Arrays”, Thomas Cipelewski and M Meilunas, IPC APEX SMEMA Council Designers Summit 04 [ 9 ] IPC 7095-Design and Assembly Process Implementation for BGAs and Engineering Department and Power Electronics Packaging Laboratory Virginia Polytechnic Institute and State University, March 27, 2001. [ 12 ] Greg Caswell and Julian Partridge, “BGA to CSP to flip chip-Manufacturing Issues”, Journal of the Microelectronics

http://www.soldertools.net/content/Learning%20How%20to%20Solder%20Training%20Kit.pdf

. Confirm the part is positioned on the pads and finish soldering all the remaining leads. Chip style components properly positioned and good solder fillets

UV LED curing oven-PCB magazine loader,PCB Multi Magazine Loader,pcb conformal coating machine,PCB l

https://www.ascen.ltd/Products/conformal_coating_equipment/584.html

. Adopt high quality Mean Well Driver LG chip small light decay. 4. CRI>80Ra, PF>0.95. 5. Water cooling way, long lifespan and working stabilization. 6. Application

PCB UV curing machine-PCB magazine loader,PCB Multi Magazine Loader,pcb conformal coating machine,PC

https://www.ascen.ltd/Products/conformal_coating_equipment/586.html

.PCB UV curing machine is available in different sizes and power. PCB UV curing machine with Teflon conveyor                      1-30cm irradiation height                  LED Chip from LG

Clariant ColorForward 2021

https://www.clariant.com/en/Business-Units/Masterbatches/Clariant-ColorWorks/CF2021

. A similar idea lies behind two tactile color samples: No WI-FI is a soft green talc-filled chip that has a soft touch, and Stupidify is bright magenta rendered in a flexible thermoplastic elastomer ., which stands for Design Augmented by Emotion, is a warm copper. The very same color can be seen as a random effect in a white chip called Yuan bei, a Chinese term referring to a sense of complete and perfect accomplishment, suggesting that neuroaethetics enables

Neutralizing Agents

https://www.clariant.com/en/Business-Units/Industrial-and-Consumer-Specialties/Industrial-Lubricants/Neutralizing-Agents

, e.g. heavy chip removal operations and emulsion cleaners applied at 80 °C or higher. Genamin CH 020 stabilizes emulsions durable and increases their lifetime also under harsh conditions

http://www.techconsystems.com/images/companies/pdf/articles/Jet-Tech-Advantages-Internal.pdf

dispensing also has been the biomedical industry’s method of choice. For creating assays and lab-on-a-chip materials, jetting offers a contamination-free method for making tiny deposits of rare, sensitive, or expensive fluids with little waste. Because of its

26594_OK int_techon brochure

http://www.techconsystems.com/images/companies/pdf/Techcon-Catalog102015-EN-Web.pdf

: Solder paste, die attach, surface mount adhesive, chip encapsulation, dam writing, two-part epoxy, UV adhesive. Key Features: • Precise and consistent shot sizes • Motor reverse capability • Field replaceable wetted parts • Adjustable dispense rate that require closed-loop motor control with encoder feed back. Typical Applications: Solder Paste, Die Attach, Surface Mount Adhesive (SMA), Chip Encapsulation, Dam Writing, Thermal Grease. Recommended Controller: TS500R Digital Controller Key Features

J.M.W. - ADMIN Inventory Listing

http://www.jmw-inc.com/Item.asp?WhichID=5856

: Lambda Machine Control Type: PC 30 Day Parts Warranty Solder Capacity with Lambda: 1850lbs Solder Capacity with Lambda & Chip: 1810lbs No Movie Available  

J.M.W. - ADMIN Inventory Listing

http://www.jmw-inc.com/Listing.asp?FindThis=

Spare Parts N/A MY-2MX32E VersaTech 8MB, 72 Pin, 2MBX32, 60ns, EDO (8 Chip) SMT Spare Parts N/A I01-KTM-M50-1G Kingston 1GB PC3200 DIMM, 400MHz DDR (LD ) SMT Spare Parts N/A E35641-15-0 Intel 30-Pin SIMM 9 Chip SMT Spare Parts N/A 72PIN-RAM Unknown 72 Pin SIMM Ram, 8 Chip SMT Spare Parts N/A 70MRCQ24 Grayhill I/O Rack SMT Spare Parts N/A 18013000 -372-03-6-1 Electrovert 480V Preheater Heater Panel for Electra Wave SMT Spare Parts N/A 3-0903-076-01-2 Electrovert Flux Stone SMT Spare Parts N/A 3-0403-022-02-6 Electrovert Chip Wave Impeller SMT Spare Parts N/A 3-0355-367-01-6 Electrovert Guard SMT

Speedline Electrovert Electra Wave Solder

http://ce-exchange.com/detail/electrovert-electra-600-f-wave-solder-6105.cfm

: Electrovert DOM: 3/00 Condition: Superior to inline with its age Facilities: 480V 3ph 60hz, 107KVA Dimms: 150" x 65" x 72" Print Page Configuration Description Specifications Terms Of Sale Dual Wave: Chip :     3 top side Vectaheat:     3 bottom side Wave Rotary chip:     standard Conveyor Automatic Width:     standard Finger Cleaner:     standard Exhaust requirements:     Three (3) 8" (208 mm) stacks: port 1 - 650 cfm; port 2 - 925 cfm

Panasonic CM402 smt placement

http://ce-exchange.com/detail/panasonic-cm402-smt-placement-5695.cfm

:   KXF-4Z4C PCB DIMENSIONS         Min L x W:   50 mm × 50 mm       Max L x W:   510 mm × 460 mm HEAD TYPE:   HIGH-SPEED      Number of nozzles:   8/head      Maximum speed:   0.06 s/chip (60,000 cph)      Space productivity:   9,560 cph/m2      Placement accuracy:   ±0.05 mm/chip      Component dimensions

Committee Home Pages | IPC

http://ipc.org/CommitteePage.aspx

Flip Chip Mounting Task Group 5-21h Bottom Termination Components (BTC) Task Group 5-21jnd Solder Paste Printing Task Group 5-21k IPC-SM-817 SMT Adhesive Task Group 5-22 Soldering Subcommittee 5-22a J-STD-001 Task Group 5-22ad Requirements for Military Systems Working & Joining Committee - China 5-21fcn Ball Grid Array Task Group - China 5-21gcn China Flip Chip Mounting Task Group 5-22acn J-STD-001 Task Group - China 5-22jcn Solder Dross Reduction Chemical Task Chip Carrier Cracking Task Group B-11 3-D Electronic Packages Subcommittee D-10 Flexible Circuits Committee D-11 Flexible Circuits Design Subcommittee D-12 Flexible Circuits Specifications Subcommittee D-12a UL 796F and UL746F Task Group D-13 Flexible

Document Revision Table | IPC

http://ipc.org/4.0_Knowledge/4.1_Standards/revstat1.htm

    Obsolete withou replacement Orig. 8/92   J-STD-003 Solderability Tests for Printed Boards  5-23a Rev C Amend 1 9/14 Rev C 9/13 Rev B  2/07 Rev A  2/03 Original 4/92; Supersedes IPC-S-804 01/04 SMC-WP-003 Chip Mounting Technology         SMEMA 7 Fluid Dispensing Terms and Definitions        IPC-WP-008 Setting up Ion Chromatography Capability   Orig. 12/05   J-STD-012 Implementation of Flip Chip and Chip Scale Technology . 10/96   J-STD-026 Semiconductor Design Standard for Flip Chip Applications  5-21g Orig. 8/99   J-STD-027 Mechanical Outline Standard for Flip Chip or Chip Scale Configurations  5-21g Orig.  2/03   J-STD-028 Performance Standard for Flip Chip Scale Bumps  5-21g Orig. 8/99   J-STD-030 Selection and Application of Board Level Underfill Materials 5-24f Rev A 3/14 Orig. 9/05     Obsolete without replacement Orig. 8/88   J-STD-075 Classification of Non-IC Electronic Components for Assembly Processes B-10a Orig. 8/08   IPC-CM-78 Guidelines for Surface Mounting and Interconnecting Chip Carriers

BGA Reballing Service – Precision PCB Services, Inc.

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. Price varies depending on chip size and quantity. Please call for a quote: (888) 406-2830 Share 0 Share on Facebook Tweet Tweet on Twitter Pin it 0 Pin on Pinterest Fancy Add to Fancy +1

Solder Balls - Lead Free .20mm – Precision PCB Services, Inc.

https://precision-pcb-services-inc.myshopify.com/products/solder-balls-lead-free-20mm

.20mm Lead Free Solder Balls (ROHS), SAC 305 250K Balls per Jar. For reballing BGA Chip. All sizes available in both Lead and Lead Free Ships within 24 hours

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Fluid Dispense Pump Integration