Electronics Forum | Mon Jan 18 18:08:38 EST 1999 | Jerry Stafford
I know there was some discussion a few months ago on this topic but I don't think a good solution was offered for checking CpK using chips using a chip shooter. I am looking for a way to measure this on our Fuji CP6-4000. Any suggestions? Jerry
Electronics Forum | Fri Jan 03 16:14:37 EST 2003 | Jacques Coderre
Hi Jon, Flip Chip is chosen as an interconnect approach when one needs improved performance (high pin count, high frequency, noise reduction or improved heat dissipation.Another driver is size...Flip Chip greatly reduces the area and therefore is cho
Electronics Forum | Tue May 04 23:22:43 EDT 1999 | MTW
Please share your experience with Bulk Feeders for chip capacitors and resistors. What you like and what you don't like in the feeder? What features you think are missing? Please give the name of the manufacturer and any idea of cost.
Electronics Forum | Mon Jan 12 18:06:38 EST 2004 | Kris
Hi, Is there any standard for voids in a leaded device or a chip component ? IPC 7095 lists maximum allowable voiding for BGA devices but has no information on leaded devices Appreciate your help- thanks
Electronics Forum | Tue Nov 05 00:54:50 EST 2013 | godfather
Suresh from India, we are in process of starting production of led display module and looking for mirae 1010 chip shooter used machine, i need know whether this machine is good for production, how to get training for this machine , please help me
Electronics Forum | Wed Apr 10 14:33:39 EDT 2019 | maximuslion
i currently have a copy of IPC-610 rev E and i cant find anything on chip shielding & staking does IPC-610 rev G make any mention of this?
Electronics Forum | Tue Jul 13 05:21:04 EDT 2010 | bubbobbed
Guys, I've received complaints from customer that the chip is sticking on the cover tape or carrier tape when detape. Is there any possible that i can solve the problem by changing the cover tape or carrier tape?? some say the root cause of this issu
Electronics Forum | Tue Aug 24 15:15:43 EDT 1999 | John Thorup
| Could use a little help here. Can anyone clarify to me the cause and fix of chip caps/resistors tombstoning following reflow? | | Any help would be appreciated. Thanks. | Most common reason is uneven heating where one side of the component ach
Electronics Forum | Thu Jan 02 21:54:18 EST 2003 | jonfox
This should be a fun one! I was asked the question from our Engineering, should we use die attach with wire bond or go ahead into the new world of flip chips? Right now, I am faced with information overload about the two processes but I am really l
Electronics Forum | Wed Aug 20 17:05:42 EDT 2008 | naynayno
We have experienced contamination under flat chip arrays. The lab report is still open but it appears to be dendrite growth. We have been trouble-shooting our process and cleaning equipment. My question is are there any specific design or best p
