Electronics Forum | Thu Nov 26 06:07:40 EST 1998 | Earl Moon
| I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is cau
Electronics Forum | Fri Nov 27 02:09:50 EST 1998 | Chi-Ting Chen
| | I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is c
Electronics Forum | Fri Nov 27 02:11:17 EST 1998 | Chi-Ting Chen
| | I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is c
Electronics Forum | Tue Nov 24 11:13:11 EST 1998 | Keith
| A buddy of mine has problems after depaneling double sided pre-scored PCB's. Resistors near the edge, after put into the slice and dice machine contain micro cracks. He's checked for them before and after depaneling. We figure it is the sectioni
Electronics Forum | Wed Oct 21 02:15:01 EDT 1998 | Kevin Christy
Dear Folks: I am currently in the pre-prep stages of a market study that's focusing on different methods of microprocessor cooling and the market potentials of new designs. I wonder if you might be so kind as to point me to good general resources s
Electronics Forum | Thu Oct 22 14:20:57 EDT 1998 | Dave F
| Dear Folks: | | I am currently in the pre-prep stages of a market study that's focusing on different methods of microprocessor cooling and the market potentials of new designs. I wonder if you might be so kind as to point me to good general resou
Electronics Forum | Thu Oct 15 17:14:50 EDT 1998 | Justin Medernach
| Hi Folks, | As I travel our industry it seems to me the trend is to move from finner and finner pitch QFP's to array packages (BGA's, CSP's, etc.). Do you folks see the same trend? What is the finest pitch QFP package you have used in your process?
Electronics Forum | Wed Oct 14 19:32:14 EDT 1998 | John Godfrey
I need to install some new lines for high mix low volume products in an already cramp building. Could someone share any info about the machines which give you the best bang for floor space. I need a 2 machine system for placing 0402 to fine pitch, B
Electronics Forum | Mon Oct 19 16:17:00 EDT 1998 | Curt Goldman
| I need to install some new lines for high mix low volume products in an already cramp building. Could someone share any info about the machines which give you the best bang for floor space. I need a 2 machine system for placing 0402 to fine pitch,
Electronics Forum | Wed Sep 30 08:57:40 EDT 1998 | Eyal Dickerman
| Hi Everybody | My company is looking to buy some precision measurement systems to measure the height of flip chip bumps (nominal height of 100 microns). We are looking for a resolution of about 2 - 4 microns. | Any help would be appreciated. | Th
