Electronics Forum | Mon Dec 23 15:20:51 EST 2002 | jax
Are there any equipment manufacturers that provide this option? I have a potential customer who has stated the other CM's he has looked at has this option on their equipment. I have never heard of an optical comparator built into a pick and place mac
Electronics Forum | Wed Apr 26 06:09:12 EDT 2017 | ajaytyagi
Hi, Pl let me know about opinion/experience whether thick film chip SMD resistor which is MSL-1 Required to bake before being usedon SMT line. I want to use SMD resistance spool which is around 2 yeasr old kept at 25 deg room temperature at around 4
Electronics Forum | Fri Apr 16 15:12:12 EDT 2021 | jsmith01
Does anyone know where the power to the lambda, chip sensors comes from on a Electrovert EPK plus? I have an intermediate issue with these sensors loosing power and the wave just keeps going higher and flows over the pot. I have replaced the senors
Electronics Forum | Mon Jan 29 11:11:29 EST 2001 | Casey Scheu
The solder ball collapse is associated with overheating. Of coarse there's no problem taking it off, your nuking it. The problem, as your aware, is in the replacement. The machine your using is overdriving the process. The key to this repair is in
Electronics Forum | Thu Apr 13 18:41:20 EDT 2000 | Michael Parker
I too have followed all of the useful suggestions provided herein. I still found some tombstoning which was specific to a manufacturers lot. I changed the reel to another brand and the problem went away. I suspect contamination or oxidation on the co
Electronics Forum | Wed Oct 06 20:42:50 EDT 1999 | Mike Cooper
Yes. We use high speed dispensing (PanasonicFA)as an integral part of our PCB assembly. Our business is automotive electronics and our typical product is 2-sided smd with some through hole. We assemble topside first, through hole, then bottomside. Th
Electronics Forum | Wed Dec 06 22:35:05 EST 2006 | davef
Questions are: * When you say, "corner of some board's BGA chips", is it on the top of the package or between the board and the bottom of the package? * If between the board and the bottom of the package, does it span the distance between the board a
Electronics Forum | Wed Dec 06 22:46:39 EST 2006 | SMTrework
Hi Dave, This is manufacturer applied epoxy / adhesive to minimize package "lifing" from chassis flexing and thius board flexing. I have seen the complete array area covered with this black or red epoxy in some cases (i.e. the underfill that I've
Electronics Forum | Sun Oct 09 22:07:51 EDT 2016 | geniepro
I would like to ask after glue bonding is abalibity drop. I test by force equipment that it is very difficult to drop after reflow 2. Very due by DIP machine. I check after Dip many chip drop. I wonder the glue not qualify I am using IR 130. Could yo
Electronics Forum | Wed Apr 12 13:25:51 EDT 2000 | Billy G
Chris, is right! Pad geometry is one of the biggest factors of tomb-stoning. Check Pad size against parts size.
