Electronics Forum: chip (Page 196 of 260)

smt production

Electronics Forum | Wed Jul 13 14:50:29 EDT 2005 | rameshn

Dear Sir, We are manufacturing Computer Motherboards & Networking products (which are having 2 to 3 BGA Chips onboard) in our plant. we are having 2 nos of HELLER 1800W model Reflow Ovens. this model reflow oven is having 9 heating zones at both top

SMD PPM data

Electronics Forum | Sun Aug 14 22:58:17 EDT 2005 | crishan

Hi All, I would like help in establishing what is a feasible PPM reject rate from a typical SMD line. As a reference an SMD line consists of, solder paste printer, chip component placement, pick and place IC components and reflow. What is a bench

COB Costing

Electronics Forum | Wed Aug 17 21:58:35 EDT 2005 | plcc

Does anyone familiar with COB process? I hv a PCBA product with one of the photodiode (size 26mmx1mm) which needs to be bonded directly on the pcb using COB technology. The wires that need to be bonded are 2, goldwires for about 100microAmp current.

Design copywrite

Electronics Forum | Wed Aug 31 12:24:50 EDT 2005 | Jaya

I have an new product which I brought from another country which I want to do some buz in my country by knowing the product sctructur and copywtite to make the product locally. It is a song player gadget (like transistor player,handheld sizeable).Th

Universal GSM1 with Shuttle

Electronics Forum | Fri Sep 23 04:12:11 EDT 2005 | siverts

Installation/set up of the component shuttle is critical. The shuttle must be perfectly squared and leveled, since it has a 4 spindle pick/place head on it. This shuttle head can pick up to 4 comps. from the shuttle feeders (gang pick) and will deliv

cap size and copper thickness vs part size questions

Electronics Forum | Mon Nov 07 12:25:32 EST 2005 | Rob

Hi CW, Larger chip caps can be susceptable to cracking, but mainly this is due to handling - flexing of boards is the main culprit (the part being mechanically joined at both ends to the board). PCB's usually flex easiest along one axis, and larger

cap size and copper thickness vs part size questions

Electronics Forum | Mon Nov 07 16:31:47 EST 2005 | CW

hi Bob, Thanks for the info. I understand your comments, but I am looking for specific guidance, If I am putting chip capacitors on a .063 FR4 board, what size package should we stay away from to avoid cracking? (I realize this is dependent on h

Lead free component VS vision on Mydata MY12

Electronics Forum | Wed Nov 09 12:06:33 EST 2005 | Rob

I don't want to throw a spanner in the works here, but a large proportion of chip resistors & capacitors have been ROHS compliant for a couple of years now, the manufacturers have just not declaired it. Could it be that the part you have just has

How is cycle time of SMT line (Chip shooter for ex) determined?

Electronics Forum | Wed Nov 16 10:56:43 EST 2005 | aj

The latest software packages and stopwatch will do the job but if your manager is anything like mine he wants to know straight away from the BOM. If you split the bom down between placement machines i.e. caps and resistors etc on chipshooter and ICs

Samsung CP45?

Electronics Forum | Tue Nov 29 16:30:05 EST 2005 | russ

We have utilized one of these for about 6mos. now (is that right Larry? I know you're reading this.) So far it has proven to be a very good machine. Getting the vision right on chip caps can be tricky and sometimes frustrating but once they are rig


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