Electronics Forum | Wed Jun 17 14:45:45 EDT 1998 | Bob
| Does any one wave solder the 0402 Chips on the bottom side of a board? | Any comments? You will need to use a curable epoxy at the site of placement before placing the 0402--then cure the epoxy...possible problems are epoxy intrusion on the lands
Electronics Forum | Wed Jun 17 16:00:47 EDT 1998 | Frank
| | Does any one wave solder the 0402 Chips on the bottom side of a board? | | Any comments? | You will need to use a curable epoxy at the site of placement before placing the 0402--then cure the epoxy...possible problems are epoxy intrusion on the
Electronics Forum | Sun May 31 16:07:25 EDT 1998 | Alain De Bock
Is there anyone who knows what the influence is of the dip-fluxing process on the placement accuracy of a flip-chip. If you perform dip-fluxing after component alignment, the component may be displaced on the nozzle; if you perform component alignmen
Electronics Forum | Tue Sep 25 15:48:34 EDT 2001 | mparker
Scavenge all the old solder off the board and the chip. Micro screen paste to the chip. As far as thickness, check your aspect ratio to determine the spec. Eliminate just one variable at a time to get to the root cause. Start by not using the tacky
Electronics Forum | Tue Mar 19 08:19:19 EST 2002 | H. Koga
Dear all: For a dramatic design mistake, we have to exchange a VSOP chip on a few thousands of already assembled PCB's. This is in addition of removing 2 & adding another 2 chip components. What do you think is the best method, technique or tool co
Electronics Forum | Thu Jul 11 17:26:27 EDT 2002 | Tony B
Does anyone know how the Fuji IP2 can be adapted to place BGA's? The MTU places the chip on a carrier with suction in the center and it will not hold on to the BGA due to the lack of a flat surface on the bottom. I have had limited success building
Electronics Forum | Tue Aug 20 22:37:15 EDT 2002 | dwoon
I notice that dip fluxing method is commonly used in flip chip assembly (FCOB, FCOC and FCOF). Main reason: better flux control. How about spray fluxing (e.g. the non-contact jetting technology from Asymtek)? Does anyone has experience adopting thi
Electronics Forum | Tue Jan 07 17:58:11 EST 2003 | davef
The following book has several chapters on various [ie, flow, no-flow, etc] underfils that could help you: Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies; John H. Lau; McGraw-Hill Professional; ISBN: 0071351418; 1st edition; 200
Electronics Forum | Thu Jan 23 07:05:19 EST 2003 | emeto
Hi all, I am interested about CSP and Flip-chip assembly.Equipment needed, accuracy, features in all parts through assembly process. If anyone can shortly explain me the assembly process(with or without underfill),or show me the place I can read it
Electronics Forum | Wed May 21 14:47:49 EDT 2003 | radney
On the new 4797 T12W8P feeders we are having trouble picking the very thin chip resistors. Adding foam to the feeder (beneath the pick point) helps, but it only minimizes our frustration. Universal has a reel of these parts and they are looking into
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