Electronics Forum | Tue Apr 11 20:31:54 EDT 2000 | Dave F
Russ: You�re correct. I should have explained our reasons for preferring concave over convex better. First, we use both also ... we just prefer concave because they: * Don�t bridge any where near as easily. * Self-center better. * Seem to have mor
Electronics Forum | Thu Mar 30 04:42:28 EST 2000 | cpgoh
HI all, thanks for the advise.. Electrovert is being used from 7am to 7pm and we do dedross from the surface of the solder bath during lunch time around 12nn. Break Time we just sweep them to the side.. Every two week, we do the solder bath maintena
Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
Electronics Forum | Tue Feb 29 22:53:13 EST 2000 | KH
I have used both the QX2 and BGA3500 hot air rework system from Metcal; both are great systems; the QX2 is a very simple system for leaded devices, easily trained and very inexpensive compared to SRT, Air Vac, and Conceptronics. The BGA3500 works on
Electronics Forum | Sat Feb 19 05:34:45 EST 2000 | Dane Stokes
Also Jan, Don't you have to send your components through a filter program when transfering from a 4796 to a 4791 or vice versa. I know you have to do this when transfering a 4790 program to a 4791 because the speed data does not transfer correctly. I
Electronics Forum | Wed Feb 23 11:12:47 EST 2000 | TMV
This note is in response to your question about not being able to recognize a component that is running on a 4796 but has problems on a 4791. The 4791 and 4796 used two different recognition systems and the lighting calibration will be not be the s
Electronics Forum | Tue Jan 23 10:57:54 EST 2001 | mdaley
Hello, I'm currently in the process of determining the best way to place bare die (flip chip) on our substrates. I've seen the Hover-Davis DDF and was impressed by it's capabilities. I particularly like the fact that I won't incur the cost of packa
Electronics Forum | Wed Feb 07 09:46:20 EST 2001 | pjc
I need some guidance here. I've got a new board w/ a FBGA-48 package, Samsung CMOS SRAM. It's a full matrix BGA w/ 0.30mm-0.40mm ball diameter @ 0.75mm pitch. Balls are eutectic. PCB land diameter is 0.4mm. There are TSOP I 0.5mm lead pitch component
Electronics Forum | Thu Mar 15 18:27:40 EST 2001 | traviss
Like I said it was only a rumor I heard but intrigued me enough to play around with it one day. The lambda wave worked better than the chip wave did with makes me believe it was the surface tension of the solder not melting the already soldered parts
Electronics Forum | Fri Mar 23 21:36:02 EST 2001 | CAL
If you do not have any luck finding a west coast lab, but need services I am sure we can help. The only problem is we are on the east coast. Many moons ago empf was on the west coast (China Lake) but moved eastward. We are in Philadelphia, PA. (ski
