Electronics Forum | Tue Mar 10 09:10:23 EST 1998 | Olivier de Brouwer
| What is the expected reliability of soldering chip inductors directly over chip capacitors. What is the expected life reduction in the field and what could be done to minimize it ?
Electronics Forum | Wed Dec 17 12:48:15 EST 1997 | Mike Cox
I need information on how to interpret the markings on ceramic chip caps. IE: a3 = .01uf etc. Any info on a source would be great Mike Cox
Electronics Forum | Thu Dec 18 04:31:24 EST 1997 | Robert Cass
| I need information on how to interpret the markings on ceramic chip caps. IE: a3 = .01uf etc. | Any info on a source would be great | Mike Cox Check the supplier they should have laser marking tables A4, AE
Electronics Forum | Sun Dec 23 08:41:04 EST 2001 | dwoon
Does anyone has experience in ACF (anisotropic conductive film) process? What is the typical bonding pressure/force/temperature for FCOG (flip chip on glass)? Will the glass crack when a high pressure applied during flip chip placement? Thanks and
Electronics Forum | Thu Mar 14 06:27:58 EST 2002 | ericchua
Hi, I'm looking at one of the stress checker. But, before going to it, I could like to find out what is the stress to damand the chip ( capacitors ). Now the production is using hand to break to the board.
Electronics Forum | Wed May 29 04:34:36 EDT 2002 | Nell
Hi, Does anyone know about the epoxy push test specifications for the SMT chips component. For example: 0603, 0402 and 0201 chips. As usual, your help is very much appreciated. Thanks in advance, Nell
Electronics Forum | Mon Jan 06 11:23:30 EST 2003 | emeto
Hi all, Can anyone give me more info about Flip Chip assembly without underfill.Some technics,necessary equipment(optics,linear motors,accuracy and so on)or where i can read about it.
Electronics Forum | Thu Jan 23 08:43:30 EST 2003 | MA/NY DDave
Hi I prefer reading piles of stuff from many sources, yet George does a reasonable job. DrFlipChip.com I understand the next SMTA in Boston will cover this and their are other web sites. YiE, DDave
Electronics Forum | Thu Jan 23 08:45:53 EST 2003 | MA/NY DDave
Oops, I used his consulting web site. Also try plain FlipChip.com. Gee I should have trusted my memory. YiE, DDave
Electronics Forum | Fri Apr 18 18:11:38 EDT 2003 | slthomas
"glue the floater in place with chip bonder before reflow" gets my vote. We have decals for DPAKs and TO-252's that don't match either specification, and chip bonder is the only answer if they won't spin the board for you.
