Electronics Forum | Thu Jul 20 16:15:24 EDT 2000 | Bob Willis
Sorry at the moment I do not have information but as usual I want to get some hands on sessions going. We were doing a flip chip workshop hands on session for Speedline last week in England. We did the theory and then hands on soldering and underfill
Electronics Forum | Mon Jun 18 10:14:30 EDT 2001 | surachai
HI ALL; I WOULD LIKE TO KNOW THAT ANYBODY CAN RUN GLUE PRINTING PROCESS WITH 0402 CHIP AND PASS THEM TO WAVE SOLDERING PROCESS ,PLEASE GIVE ME THE INFORMATION ABOUT THEM . 1)HOW WIDE OF APERTURE DO YOU OPEN ON YOUR STENCIL? 2)HOW MANY YIELD OF THIS P
Electronics Forum | Thu Aug 12 00:02:29 EDT 1999 | dean
| We currently have 32 LEDs per board and are looking to change the LED from a gull wing package to another package. (possibly a chip type package). I have heard that some cases and LEDs do not like reflow. This part is not cost effective to have to
Electronics Forum | Fri Jul 16 10:55:54 EDT 1999 | Jeff Ferry
We have been asked to rework several thousand bare circuit boards. A design change now requires 2 chip components where 1 was originally required. Round test pads near this area will be used to complete this circuit rework, however these test pads a
Electronics Forum | Thu Jul 22 03:58:28 EDT 1999 | George Verboven (Process Engineer)
| We have been asked to rework several thousand bare circuit boards. A design change now requires 2 chip components where 1 was originally required. Round test pads near this area will be used to complete this circuit rework, however these test pads
Electronics Forum | Mon Dec 07 17:56:45 EST 1998 | Tom Braswell
I have been put incharge of developing a process to rework a doublesided SMT PCB with DCA/COB (direct chip attach, chip on board ) components. The rework will consist of removing some 603-1206 chips on both sides of PCB, oh yeah its has a polyuretha
Electronics Forum | Fri Oct 16 00:18:35 EDT 1998 | Jim McCarten
I would not expect 30 microns to be good enough for flip chip. Maybe I have it wrong, but isn't that +/- 1.5 mils? With bumps on flip chip approaching 3 or 4 mils, I would stay away from a 30 micron machine! | |John, | | Why do not you consider t
Electronics Forum | Wed Sep 09 07:40:20 EDT 1998 | Jon Medernach
What is the pitch of the bumped die? What is the method of attach? C4? Key features required for FC attach include. Ability to program and measure Z force, system should calibrate on startup. Placement accuracy will determine pitch you can place.
Electronics Forum | Thu May 14 16:25:35 EDT 1998 | Chrys
Last week I posted a message on rotary chip waves that stated that the drive shaft had a protective boot around a u-joint that degraded and exposed the joint. Someone from the manufacturer read it and contacted me. He told me the problem has been re
Electronics Forum | Thu May 28 15:56:26 EDT 1998 | John
| Last week I posted a message on rotary chip waves that stated that the drive shaft had a protective boot around a u-joint that degraded and exposed the joint. | Someone from the manufacturer read it and contacted me. He told me the problem has bee
