chip

"chip" search results in the Electronics Forums



2509 results found for "chip" in the Electronics Forums

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Solder balling under passives

Sep 19, 2016 | Hi guys, Problem: Mid chip solder balling. Component affected: 0603 caps only Defect is P

Assembleon Opal nozzle repair

Aug 24, 2015 | Can Assembleon Opal nozzles be repaired? I have > a few ith chips on the corners of the tips. It

Identify smt component

Jun 24, 2014 |

SMT vs TH

Mar 2, 2011 |

SMT vs TH

Mar 2, 2011 |

BGA Reflow profiles

May 25, 2009 | hi, we tried making a profile of a chip ATI 9000 mounted on a toshiba laptops, this is on a small

Solder balls

Jul 17, 2008 |

Tombstone/ Poor welting

Feb 21, 2008 | I have seen smt chip varistors with Pd/Ag teminations that had poor wetting in terms of good fillet

Universal Instruments Lightning Heads

Sep 26, 2007 | So far, So good! We are currently standardizing the Lightning Head Advantis as our chip-shooter.

Homeplate design

Jul 25, 2007 |

Imm Silver and Voiding

Jun 23, 2006 |

MYDATA Myspeed software is total junk

Feb 13, 2006 | Hi Grant, Does the Flex mag have the corect pal chip in it? Some of the early Flex mags had tm8 p

Lead free components in 62/36/2 paste prob.

Nov 21, 2005 | We are facing the problem of dry soldering in chip capacitor 0603. When we told the Vender then h

cap size and copper thickness vs part size questions

Nov 7, 2005 | How large of chip capacitor can we use reliably? I��ve heard they tend to crack. I��ve also heard

SMT Assembly

Sep 9, 2005 |

CSP No clean residue

Mar 15, 2005 |

CSP No clean residue

Mar 15, 2005 |

CP6 pickup errors

Feb 24, 2005 |

Dream SMT Line

Apr 30, 2004 |

Repairing balls on BGA's

Jul 17, 2003 |

IR oven profiling

May 19, 2003 |

Standard kit in LVHM environment

May 13, 2003 | I currently am doing it. Keep in mind the parts are split up, such that, the chips are on one machin

Adhesive Dispersion Specifications

Oct 21, 2002 | We hare having an issue with our chip shooters misplacing or not placing parts all together. We hav

RFID devices in SMT

Sep 2, 2002 |

Comparison between Glue & solderpaste process

Jun 21, 2002 | Hi Russ, Thanks for your input.My board has SMT Chip components, SOT23,SOIC's & 2QFP (25MIL PITCH).

Tombstoning

Jun 15, 2002 | well we can't paste the flip chip on its substrate because we are using flux...because this bare die

solder ball

Jun 6, 2002 |

solder ball

Jun 4, 2002 | I found solderballs are around chip components (on one side of middle area), I checked gerber data,

Flux encapsulant

Apr 1, 2002 | Hi, Heard about flux encapsulant - a compression-flow flux and underfill product for flip chip as

Thousands of TSOP or VSOP To be replaced after assembly

Mar 20, 2002 | Guy's I am sorry but your dike removal process for chip components is midievil at best. The fastest

BGA Via Plugging

Feb 7, 2002 |

Juki 2000 Series Machines

Jul 26, 2001 |

0201, anyone??

Jul 26, 2001 | Anyone tested or running 0201 chips?? T4 paste needed for this process? and what are the main factor

SMT Process

Jul 23, 2001 |

SMT Process

Jul 23, 2001 |

solder balls

Jul 5, 2001 |

SMD voids

Jul 3, 2001 | Any opinion/spec/study on acceptability based on size and location of void in chip cap/res (e.g 0402

BGA Voids

May 3, 2001 | Does any one experienced problems on BGA voids related to height of chip (placement), and also anoth

Solder balls

May 2, 2001 |

Conformal Coating Machine under 40000

SMT Pick and Place