Electronics Forum: chip and component (Page 1 of 176)

Clearance between Through hole and chip component

Electronics Forum | Tue Feb 27 11:03:09 EST 2007 | Marcin

Hi All, Anybody knows what is the minimum clearance between through hole component and chip component? Problem description: On bottom side of my pcb are only 0603 chip components mounted on glue. One of the component is located very close to hole

Clearance between Through hole and chip component

Electronics Forum | Wed Feb 28 21:42:56 EST 2007 | davef

Very smart, Chunks.

Clearance between Through hole and chip component

Electronics Forum | Wed Feb 28 11:43:20 EST 2007 | realchunks

Marcin, Think outside the box. If you are glueing the SMT part down, why not have an aperture cut in your stencil (or recut a stencil) between the SMT part and thru-hole. Wave solder hates SMT glue. This will get rid of your solder short problem

Clearance between Through hole and chip component

Electronics Forum | Tue Feb 27 20:53:10 EST 2007 | davef

We'll guarantee the two pads are too close together. The proper spacing depends on the orientation of the parts to the wave. * Do the pads hit the wave at the same time? * Does one pad hit the wave before the other? If so, which? * How does the 06

Clearance between Through hole and chip component

Electronics Forum | Wed Feb 28 00:01:47 EST 2007 | Muhammad Haris

Hi, The distance between the two terminations/endings/pads of 0603 (0201)is 0.15mm i.e. lesser than than the distance between the 0603 and through hole i.e. 0.5mm My ques is that, then why its termination doesnot short as it has a minimum distance.A

voids- leaded and chip components

Electronics Forum | Mon Jan 12 18:06:38 EST 2004 | Kris

Hi, Is there any standard for voids in a leaded device or a chip component ? IPC 7095 lists maximum allowable voiding for BGA devices but has no information on leaded devices Appreciate your help- thanks

voids- leaded and chip components

Electronics Forum | Tue Jan 13 22:07:42 EST 2004 | davef

No, there is no such information. Choices are: * Recognize that any voiding is a process indicator and that when observed, indicate a requirement for taking corrective steps. * Tell your quality people to quit looking at components other than BGA wi

voids- leaded and chip components

Electronics Forum | Wed Jan 14 08:45:04 EST 2004 | Kris

Thanks Dave Will appreciate if any body has any published information on a study they did for voids in leaded devices Will try to talk to them Dave

voids- leaded and chip components

Electronics Forum | Mon Jan 19 18:49:42 EST 2004 | menglong

we are facing the same problem,and we are looking for some research result about voids.who can help to provide these ones ? any suggestion, pls keep me informed contact me :zhanglg@tpv.com.cn

voids- leaded and chip components

Electronics Forum | Fri Jan 23 10:39:35 EST 2004 | patrickbruneel

Kris, I assume with voids you mean acceptable solder coverage of pad and lead. As Dave mentioned I also have not seen any specific studies on voids, but workman ship standards exist about acceptable coverage of pad and lead (both consumer and MIL)

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