Electronics Forum | Wed Feb 11 09:07:37 EST 2004 | Ashok Thiyagarajan
HI I am currently having a wafer which is stud bumped (Au), I am printing conductive adhesives (with silver fillers) on the pads , and by thermocompression bonding, I am establishing the connnection between. But right now the problem is the silver
Electronics Forum | Mon Sep 08 11:54:42 EDT 2014 | gregp
Hello Spoilt... Yes it's true about the kitting being important but we also offer a component tester/verifier option for our system. The components can be tested for each insertion if you wish. The machine will not allow a component to be inserted
Electronics Forum | Thu May 10 02:57:03 EDT 2001 | kjellman
Hi, Why not have a look at Philips/Assembl�on, their ACM machine is quite nice. It may also bring you down to Flip Chip, 0201 some through hole and odd form placement. Nice options like bulk feeding, coplanarity tests, fluxing for FC, prom feeders (
Electronics Forum | Mon May 21 17:32:23 EDT 2001 | davef
I said: "Our electronic circuit board fabricators seal the boards in moisture barrier bags [MBB]. We discontinued the use of desiccant bags in these MBB because of concerns about the desiccant releasing materials that would affect the solderability
Electronics Forum | Thu Oct 13 15:34:55 EDT 2005 | Amol
Hi, We are in the process of transitioning to LF production. What are some of board materials being successfully used in production? Also, what surface finishes show promice of good results with SAC 305 solder? We are currently testing multiple boar
Electronics Forum | Wed Dec 15 19:31:26 EST 2004 | Thomas Denison
We have a ceramic BGA that the component supplier has misaligned the spheres in the fixture so they slant .007" out of alignment from the substrate pads. When the devices are tested at the component manufacturer this alignment issue also causes the
Electronics Forum | Mon May 14 09:35:21 EDT 2018 | directx995
Hello everyone, A few days ago I design one special kind of PCB for testing accuracy of our Pick and Place machines. (for trimming, calibrating, NPI etc.) I am looking for adhesive spray, to apply it on PCB (at the moment I'm using double sided tape
Electronics Forum | Sun Apr 25 12:05:50 EDT 1999 | Chrys Shea
| | | Has anyone had trouble waving and gluing 0603 R's and C's? At my company, our designers have "opened the floodgates" on bottom-side 0603's. | | | | | | We've got an EPK+ with rotary chip and omega wave but can't seem to get skip-free solderin
Electronics Forum | Mon Apr 26 09:18:27 EDT 1999 | C.K.
| | | | Has anyone had trouble waving and gluing 0603 R's and C's? At my company, our designers have "opened the floodgates" on bottom-side 0603's. | | | | | | | | We've got an EPK+ with rotary chip and omega wave but can't seem to get skip-free so
Electronics Forum | Thu Apr 07 09:24:47 EDT 2011 | rway
What version of sw are you running? There are some new features in 2.7.7 and earlier that may be of benefit to you. With chip caps you are testing for presense/absense. The gain/offset feature can be used to give you better contrast between the pa
