Electronics Forum: chip bonder (Page 1 of 5)

flip chip bonder

Electronics Forum | Wed Sep 23 20:38:30 EDT 1998 | parag

does anyone know what exactly the term "characterization of a machine" means?i need to characterize a flip chip bonder which has the capacity to mount the dies on substrates not more than 2" x 2" size.please respond asap.

Re: flip chip bonder

Electronics Forum | Thu Sep 24 13:17:34 EDT 1998 | Dave F

| does anyone know what exactly the term "characterization of a machine" means?i need to characterize a flip chip bonder which has the capacity to mount the dies on substrates not more than 2" x 2" size.please respond asap. Parag: Check the link bel

Re: flip chip bonder

Electronics Forum | Thu Sep 24 07:43:12 EDT 1998 | Earl Moon

| does anyone know what exactly the term "characterization of a machine" means?i need to characterize a flip chip bonder which has the capacity to mount the dies on substrates not more than 2" x 2" size.please respond asap. Characterization means det

BGA chip corner epoxy / adhesive?

Electronics Forum | Thu Dec 07 19:54:55 EST 2006 | davef

We agree with "guest" above. This a "chip bonder" type material used to improve the reliability of array type devices. "A relative comparison of the N50 values is given below: No underfill = 1.0X (baseline) Corner bond = 1.3X Non reworkable underfi

reflow profile

Electronics Forum | Sat Sep 22 14:33:50 EDT 2001 | Tony

I like to secure the thermalcouples with a small dot of chip-bonder(surface mount adhesive). The chip-bonder will cure durring the first pass through the oven. After I have developed my profile I remove thermalcouples and the chip-bonder with a solde

Skewed transistors

Electronics Forum | Fri Apr 18 18:11:38 EDT 2003 | slthomas

"glue the floater in place with chip bonder before reflow" gets my vote. We have decals for DPAKs and TO-252's that don't match either specification, and chip bonder is the only answer if they won't spin the board for you.

Epoxy for holding large inductors

Electronics Forum | Wed Jan 14 17:21:04 EST 2009 | davef

We love Loctite 3609 as a chip bonder, but would never consider it to secure large components

Double Sided Reflow

Electronics Forum | Thu Mar 17 10:30:06 EST 2005 | davef

This happens. You may need to put a dot of chip bonder on the corner of the floating QFP after first pass. What size are the QFP that are moving?

Alternatively Colored SMT Adhesive (Chip bonder)

Electronics Forum | Mon Aug 14 09:58:34 EDT 2006 | RLM

Check Epotek http://www.epotek.com Look in their General adhesive section. Epotek 600 is black if it will work for you.

SMT adhesive suggestions?

Electronics Forum | Fri Jul 20 08:16:48 EDT 2007 | hussman

Wow, I've never heard of this. If it voids during cure you either have a hot profile or bad adhesive. We use Loctite Chip Bonder. No problems.

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