Electronics Forum | Sat Sep 22 14:33:50 EDT 2001 | Tony
I like to secure the thermalcouples with a small dot of chip-bonder(surface mount adhesive). The chip-bonder will cure durring the first pass through the oven. After I have developed my profile I remove thermalcouples and the chip-bonder with a solde
Electronics Forum | Wed Jun 18 09:43:42 EDT 2003 | blnorman
We have a line that is double sided reflow and reflow/wave depending on the product being manufactured. We asked Loctite if we could cure our chipbonders with the reflow profile to eliminate having to change oven profiles for each. They said we wou
Electronics Forum | Mon Feb 24 15:14:21 EST 2003 | blnorman
Having worked with adhesives for years, the first thing to look at if there is a failure of this type is surface contamination. The subject has been discussed here also. A structural adhesive will increase in strength with a "hotter" cure. We also
Electronics Forum | Thu Aug 13 10:58:58 EDT 2009 | davef
First piece of advice: build the board as you would any other board. Probably, you will be surprised at the holding force of the solder of the connections of the BGA, because the surface area of the solder is very large compared to the weight of the
Electronics Forum | Fri Jan 16 16:36:37 EST 2009 | rwyman
We've used our standard chipbonder- Heraeus PD944- for this type of application. While it does cure before reflow, when the part is placed onto the site, the material compresses and spreads and thus that potential standoff isn't an issue. We've als
Electronics Forum | Thu Jun 27 11:56:40 EDT 2019 | slthomas
It seems to me that it would be easier to manually apply a little bit of chipbonder on the edge of the part after the first reflow than to tape the part down. The epoxy would cure sufficiently before the second reflow to secure the part after the s
Electronics Forum | Wed Aug 10 16:37:35 EDT 2011 | davef
Yes, there are ways to machine process boards like this. The devil is in the detail. In no particular order, your choices are: Process flow #1: * Print chipbonder on the surface mount side for SMT parts * Mount SMT components * Cure adhesive, if r
Electronics Forum | Thu Oct 15 17:29:29 EDT 1998 | Christopher L.
| We have a need to bond Flatpack and Quadpack components to the circuit board. The adhesive should be quick curing, repairable and have a low modulus. It does not have to be thermally conductive (but it would be a plus). The components are current
Electronics Forum | Thu Oct 15 21:19:21 EDT 1998 | Scott McKee
| We have a need to bond Flatpack and Quadpack components to the circuit board. The adhesive should be quick curing, repairable and have a low modulus. It does not have to be thermally conductive (but it would be a plus). The components are current
Electronics Forum | Wed Jan 22 13:31:23 EST 2003 | jonfox
Elongated slots!! Our older runs are a pain sometimes with parts (1206, 0805 chips) twisting as they go through cure. I'm sure that its not all due to the dots, but I'm sure that it doesn't help either. We don't see this effect on our runs that us
