Electronics Forum | Fri Dec 07 09:54:05 EST 2012 | davef
Try MIL-STD-883 Method 2017 Die inspection service providers may be willing to help Services, Die inspection * Amkor amkor.com * Syagrus Systems syagrussystems.com SMTA has published a lot of papers that track to 'die' & 'inspection' but most oft
Electronics Forum | Wed Mar 20 13:06:19 EDT 2013 | kmots15
We've placed some crazy parts with Mydata but always used the mechanical centering jaws as the vision algorithm is lacking for pattern recognition. Could easily do a poker chip (or other circular things) in the X&Y but maybe the text wouldn't be str
Electronics Forum | Fri Mar 22 18:16:44 EDT 2013 | vpham
We are trying to use this high-temp solder paste due to a very special process, but we run into tombstones on chip caps, 0402 and 0603. We don't have this problem if we use regular SAC305 solder paste. If you have experience with this type of solde
Electronics Forum | Wed Jun 12 17:05:41 EDT 2013 | danselness
DeanM - thank you for your response. I will work on uploading a picture of the bridges. We are focusing our efforts on nine boards that use the TO-220 package. I will also pass along your idea of Oval Pads to our Manufacturing and Design Engineers
Electronics Forum | Tue Feb 25 11:20:31 EST 2014 | detecheurope
Hi Rob, If you are still looking for equipment then we may have a handful of machines suitable for your requirement, we have three second user pick and placement machines available with the capacity to place over 15,000 chips per hour. Please drop
Electronics Forum | Mon Mar 03 07:15:24 EST 2014 | JB
Thanks for the reply, how do people handle different packages then if you can't add new ones? If we had a 1206 sized inductor, then a 1206 sized ferrite bead and so on, they would all have to be grouped under the same generic heading? e.g. Chip-R321
Electronics Forum | Thu Mar 27 07:56:04 EDT 2014 | rrosera
My company is researching the use of re-workable underfill for use on our avionics boards. We are currently testing Hysol UF3810. The Rework machine we use has a vacuum based removal system witch isn't strong enough to overcome the underfill. We have
Electronics Forum | Thu Apr 24 06:33:07 EDT 2014 | sarason
Since you are chasing down communication errors as a likely root cause of your problem. Perhaps the RS232 COmmunicaions chip was taken out as well. This was a common enough problem in glorious days gone past fixing really old RS232 gear. ALso caps Po
Electronics Forum | Mon May 26 08:23:49 EDT 2014 | mun4o
hi all, we have smd line with 2 Assembleon topaz X.The real speed of the line is about 12- 13k cph.I want to increase this speed.I intend to buy a Assembleon sapphire and change one of topaz with sapphire ( chip shooter).Has anyone of you similar c
Electronics Forum | Fri Jun 20 07:31:34 EDT 2014 | mdavister
I'm not positive, but it looks like it could be a multilayer chip capacitor with the end metalization on the long side. They do exist: http://www.mouser.com/ProductDetail/AVX/0612YC105KAT2A/?qs=sGAEpiMZZMukHu%252bjC5l7YbS7Gp8EQB5AtLAgTHK6PsA%3d
