Electronics Forum | Thu Sep 11 23:50:51 EDT 2003 | Dean
Epoxy is hydroscopic. A cavity will form when the cure furnace reaches the boiling point of water. The steam expansion creates the pocket. It can be large enough to be filled with molten solder from the wave machine and cause a hard short under th
Electronics Forum | Tue Sep 16 10:57:01 EDT 2003 | Gabriele
Also most of Tantalum Caps are iron-magnetic material made, for sure is not this case but always wen we met problems like James met, we had always sot-23, light capacitors 0603 as you know some of them have Nikel barriel (also magnectic sensitive) an
Electronics Forum | Fri Oct 10 19:14:27 EDT 2003 | MA/NY DDave
Hi SMTAnet, SMTnet, I am pretty sure recently I heard and read a report with them simply reflowed with an improvement in strengths from a slowly degrading strength. I can't find it quick and don't remember all the caveats like maybe an underfill phe
Electronics Forum | Tue Oct 21 23:28:59 EDT 2003 | xz xiao
We all know the Lead Free process is trend, so we trial run it, now it is only my comment that we have a good achievement after several tries,we have taken serveral photos about Lead Free process with ErsaScope. 1.The surface of the solder joint are
Electronics Forum | Tue Oct 21 23:29:08 EDT 2003 | xz xiao
We all know the Lead Free process is trend, so we trial run it, now it is only my comment that we have a good achievement after several tries,we have taken serveral photos about Lead Free process with ErsaScope. 1.The surface of the solder joint are
Electronics Forum | Thu Nov 27 02:52:33 EST 2003 | Giordano Trecca
I'm using a CIM software (http://www.aiscorp.com/products_npi_circuitcam.htm) to import gerber files and produce pick&place programs and paper/paperless documentation. It's very friendly, useful and fast, but not cheap. I don't know any other softwa
Electronics Forum | Fri Dec 19 10:30:08 EST 2003 | haviland
Tony--Good morning. We deal in used and refurbed equipment and have a nice Panasonic line available now w/ DEK 265 printer, Pana PFA MV2CXL chip shooter w/ +(130) feeders, Pana MPA3F w/ +(60) feeders, BTU VIP 70 Reflow, several pieces of input and bu
Electronics Forum | Wed Feb 11 09:07:37 EST 2004 | Ashok Thiyagarajan
HI I am currently having a wafer which is stud bumped (Au), I am printing conductive adhesives (with silver fillers) on the pads , and by thermocompression bonding, I am establishing the connnection between. But right now the problem is the silver
Electronics Forum | Thu Feb 19 09:02:43 EST 2004 | russ
This is a pretty common sympton when wave soldering chip components. As a note IPC allows for this in wave process. The problem is in the pell off of the wave and you may not be able to fix. Is your back flow off of the wave only present when a bo
Electronics Forum | Thu Mar 11 12:05:22 EST 2004 | russ
the ones we use have a temp adjust/control. To answer reflowing adjacent components we reflow them during the rework. However if we do not want to reflow we either change the tip on the gun to a more localized area or we apply temporary mask to pre
