Electronics Forum: chips (Page 226 of 260)

BGA rework

Electronics Forum | Wed May 22 13:51:20 EDT 2002 | Phil

2 suggestions - Get a good scope - at least a 4X, but more like a 6X, 10X is best. You have a choice on used equipment for a substantial savings. A Leica Stereo 4 zoom is it. You can look for BGA scopes that have a 90` angle for looking at the balls

First Article Inspection

Electronics Forum | Wed May 15 22:23:38 EDT 2002 | ianchan

Hi mates, need some help to resolve a thumb-twine situation. As a high-mix, low volume prototype build house, we always conduct a first article inspection (FAI) on every model setup conversion in the SMT production Lot run. we do this FAI by mounti

Profiling board

Electronics Forum | Thu May 23 12:27:53 EDT 2002 | johnw

yngwie, are you getting a wave from the customer to say it's not your fault you fried the parts? Profiling's one of those things that is a pain to dobut it's one of the most important factors in the assembly processes. I've read and seen instances w

Are US OEM Manufacturers Dead?

Electronics Forum | Sat Jun 01 18:00:19 EDT 2002 | stefwitt

I guess we can only speculate about the outcome of this recession. By shifting manufacturing to China, we also transfer technology and know how. If just the market of telecommunication takes off, boards of the latest technology ( flip chip, wafer fe

Can F4G connect with more than 8 CP7 or QP3?

Electronics Forum | Tue Jun 11 14:45:59 EDT 2002 | stefwitt

I can not find a F4G in Fuji�s equipment list. Siemens has a F4 ( flexible fine pitch machine ) and also a GII ( glue dispensing machine ), which both would make sense to add to your equipment list. Machines are �connected� together with their conve

Tombstoning

Electronics Forum | Thu Jun 13 11:27:25 EDT 2002 | davef

>*Changing paste >EricD: Yes we are considering that as a point. Because I believe the paste we are using are in syringe packaged and designed for dispensing. We are using an Indium SMQ75 paste and current application naturally is stencil printing.

Solder Bridging on BGA

Electronics Forum | Thu Jun 13 20:55:46 EDT 2002 | russ

Having just gine through a similar problem myself (with much less equip.) Here are a few things to consider and/or look at Do you have the proper pad size? It should be the same size as the pad on the BGA. Is the board warping during your operati

Feeder tape size

Electronics Forum | Fri Sep 27 15:07:50 EDT 2002 | barryg

Genny, you may want to look at the brds you will be running and identify the various packages. I do not know what a standard package is. Most chip resistor and capacitors, 0402, 0603, 1206, 1210's are on 8mm feeders, but ic's vary quite a bit. Also r

BGA dead bug pick and place

Electronics Forum | Mon Oct 28 09:48:10 EST 2002 | gregp

If I understand correctly you want to pick BGAs from the ball side using some type of vacuum arrangement. You will find that the reliability of this is dependant on the size of the balls and the pitch. The larger the balls and tighter the pitch, th

quad 4c

Electronics Forum | Wed Nov 27 18:10:41 EST 2002 | andrewbrook

Quad4C's have their moments. If the price is right and you are aware of the machines limitations then you will be satisfied. The placement rate is slow, 1.2 seconds/chip. Don't buy any Quad if it has the CyberOptics Laser unit, the Quadalign unit is


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