Electronics Forum | Thu Dec 24 02:17:22 EST 1998 | Chris Grendler
Anyone ever attach gold bump flip chip to FR4 or Alumina substrates. Am trying to find a solder which is acceptable for use on gold. Am worried about gold imbrittlement since the gold bumps on the flip chip are .004"x.004"x.001" solid gold. The pit
Electronics Forum | Thu Dec 24 09:32:53 EST 1998 | Earl Moon
| Anyone ever attach gold bump flip chip to FR4 or Alumina substrates. Am trying to find a solder which is acceptable for use on gold. Am worried about gold imbrittlement since the gold bumps on the flip chip are .004"x.004"x.001" solid gold. The p
Electronics Forum | Thu Dec 17 12:47:23 EST 1998 | Mike
What is the CPH for Universal/Sanyo chip shooter? Spec. needed only. Thanks
Electronics Forum | Mon Oct 26 20:04:23 EST 1998 | Dave F
| Hi, | | My question is how close can you place smd 0603 chip resistors to each other with having an assembly problem? | I know the pick and place machines don't need a lot of clearance, Iam more concerned about the court yard area around the com
Electronics Forum | Mon Sep 14 16:44:37 EDT 1998 | Steve A
| Reading some technical report I found the term "CSP", but no explanation. | I guess something about Chip Scale Package... but not sure. | Could someone please explain it to me? | Rgds, | Anderson You are absolutely correct. CSP is an acronym for C
Electronics Forum | Wed Feb 25 16:39:29 EST 1998 | Eldon Sanders
I agree with Chrys, get the spike temp up and wetting is not a problem. However, when the palladium mixes in with the solder the joint will become more brittle. You need to make sure enough solder is printed on the board to minimize the concentrati
Electronics Forum | Wed Feb 25 17:02:05 EST 1998 | Doug Romm
Just a comment to clarify this discussion. Typically chip caps and other passive components that use palladium plated to the end of the component are very different from the TI nickel/palladium plated IC components (leaded devices). The main di
Electronics Forum | Thu Sep 27 16:11:38 EDT 2001 | flipchip
Monkey, I have read all the replies you received. I have extensive experience in reworking these parts. There are several ways to approach your problem. If the chips are bumped you will need to have a stencil to apply the flux. If the chips are u
Electronics Forum | Thu Feb 06 14:27:18 EST 2003 | MA/NY DDave
Hi You already have some good answers. Let me add just a little of what I know. You might want to check the IPC and obtain their guides on this technology. Also SMTA, NEPCON and others have technical proceedings on this technology. Checking with e