Electronics Forum | Wed Jun 24 08:28:16 EDT 2020 | pickplace
Hi Jacobo, it would be importatn to know what kind of error the machine is displaying. Are the chips in paper or plasic tape? Did you check pickup coordinates and hight? Have you many false edge pick vision errors? Then I would switch off the tombest
Electronics Forum | Wed Jan 18 11:26:22 EST 2017 | dilogic
Is there something special to care about while reflowing CMOS camera chips? They are pretty reflective on the surface, so I guess IR-type oven is not the best choice...
Electronics Forum | Fri Aug 10 04:19:05 EDT 2001 | wister
There are lots of voids at solder joint of chips,the thickness of multilayer pcb is 3.2mm,top side have lots of chip component and bottom side has several BGA and QFPs.For top side profile,the preheat time is about 100s,soak time is about 75s,time ov
Electronics Forum | Mon Jul 21 10:33:51 EDT 2008 | maxpower097
Hey guys. I'm a newb and was thrown in to this project. The company I work for opened some spools of chip they have and it says on a sticker, "BAKE if PINK" and it is pink. Is this something we can do onsite? I have researched it and it says bake a
Electronics Forum | Thu Mar 05 12:58:01 EST 2020 | joeljacobo
Hi everyone, I hope you can help me with this matter. We have a Hanwha SM482 machine and a series of projects involving many 0201 components (resistors, capacitors, inductors, etc.) will be carried out. Making the prototypes I noticed that there is
Electronics Forum | Tue Aug 14 17:55:01 EDT 2001 | Boysen
Are you using a water soluble paste? Older generations of water soluble paste are notorious for voiding. Some of the new generation water soluble fluxes allow a much wider process window.
Electronics Forum | Fri Jun 12 18:21:52 EDT 2020 | proceng1
I've had components move in the pocket and cause mis-picks. Generally, the part moves, but settles in the pocket after a moment. So I slowed down the pick up speed. It gave the part in the feeder a chance to settle before picking.
Electronics Forum | Fri Aug 10 13:09:49 EDT 2001 | Hussman
Hey Wister, Assuming you are talking about BGA voids, and you just want to try and optimize your profile, you could try a "straight ramp profie". This is where the soak temp is constantly being elivated until you hit reflow. I find this helped me
Electronics Forum | Mon Jul 21 11:10:29 EDT 2008 | davef
We blab about component baking all the time. Search the fine SMTnet Archives for more, like: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=52970 Here is good background materal on MSD: http://www.smta.org/msd/msd.cfm
Electronics Forum | Tue Jul 22 16:51:14 EDT 2008 | maxpower097
OK I have read though all the treads and learned more. One more question if someone can answer it. Can I do this myself on site? We have a Vitronics Soltec XPM820 Reflow Oven. Or do I need a super special oven for component baking.. Thanks max
