Electronics Forum | Tue Apr 18 10:56:35 EDT 2006 | jaymcgowan
I am working on a new product that has a flex circuit attached to an 8 layer motherboard. There are 25+/- connections. I am investigating hot bar soldering vs ACF (conductive film) to make the attachment. I am looking for literature/papers/experim
Electronics Forum | Thu Jun 15 08:46:33 EDT 2006 | davef
Centroids from the Gerber data * Graphicode GC-Place graphicode.com * Downstream Technologies CAM350 downstreamtech.com * Gerbcam Tecnomatix-Unicam unicam.com * Circuit Cam aiscorp.com * GerbTool GerbTool.com * Send it to smtservice@comcast.net. They
Electronics Forum | Thu Jul 27 16:06:18 EDT 2006 | chrisgriffin
You will have to be more specific about your boards and process to get any help. There are many different types of in circuit tests and functional tests throughout the manufacturing process. The nature of these tests depend on board function. Sinc
Electronics Forum | Wed Oct 04 13:06:21 EDT 2006 | greg york
Sorry Bert For some reason I'm not getting the Email notifications so appologies never saw the reply. The mettalic antidrossing agent reduces the dross to levels of est. 50% less than compared to 63/37 alloy. When used with SACP/0307 alloy and SACP/
Electronics Forum | Mon Aug 14 20:37:03 EDT 2006 | davef
JEDEC defines packaging, matrix trays, tape and reel, and like whatnot. You need to be searching ANSI and IPC. Find these documents: * ANSI/J-STD-020, Moisture/Reflow Sensitivity Classification for Plastic Integrated Circuit Surface Mount Devices *
Electronics Forum | Mon Aug 21 15:02:53 EDT 2006 | FredC
If you really have Loctite Super Glue it is a cyanoacrylate and can be removed with acetone. If you have a Loctite aneorbic glue that has not hardened yet, acetone will remove it. If an anerobic has hardened I know of nothing that will remove it. Als
Electronics Forum | Thu Aug 24 17:29:02 EDT 2006 | GS
Also, Make sure the Caps are suitable for Reflow temperature. It may be they are suitable only for wave solder temperature (ie. Murata capacitors can be: GR..... only for Wave Solder GRM...... can withstand Higher Reflow temp...) Several years ag
Electronics Forum | Tue Sep 26 18:06:13 EDT 2006 | russ
could be black pad, or it is just bad reflow profile that did not get all balls soldered down. OR it could be a planarity issue between BGA and fab during assembly. Can we assume that this is proven design? Somewtimes in new design touching a BGA
Electronics Forum | Thu Nov 16 18:41:17 EST 2006 | John Fisher
Unidec repairs of industrial electronics specializing in the surface mount (SMT) and through-hole circuit board equipment, robotics, vision systems and general automation. Plese see our website at http://www.unidec.com of call toll free at 888-701-00
Electronics Forum | Mon Oct 30 03:18:09 EST 2006 | geb
Hi Mika, Thanks for your reply. We've managed to narrow down the fault to the control board (long rectangle one in front of the camera). It turned out to be a logic IC that had blown MM74HCT244N (U17 I think). A circuit diagram would be useful beca
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