Electronics Forum | Wed Oct 26 14:29:55 EDT 2005 | barryg
We have a class 3 assembly we will be doing soon and I was wandering since the fillet heighth required for class 3 is 50% more than class 2, should I have my stencil thickness increased from 6 mil. to 7 mil.? This assembly is made up of 31 mil. pitch
Electronics Forum | Thu Oct 27 07:57:35 EDT 2005 | Bob R.
Nearly all of our assemblies have to meet class 3 requirements and we regularly use 5 and 6 mil stencils. If you've got reasonably well controlled processes you won't have any trouble getting class 3 joints on QFPs and discretes.
Electronics Forum | Wed Aug 20 10:31:41 EDT 2003 | billdampier
We have some new customers that are requiring class 3 IPC standards, and my question is, how would that translate into a labor rate increase as compared to class 2 rates? I'm assuming the labor quote would increase by at least 15-20%, if not more. An
Electronics Forum | Thu Feb 05 14:30:29 EST 2015 | chsravan
Can I apply IPC-610 class 3 workmanship standards to an assembly made with a IPC-600 class 2 PCB?
Electronics Forum | Fri Feb 06 11:11:04 EST 2015 | mascott123
I have asked that same question to a co-chair of the J-STD-001 committee who in turn checked with personnel at IPC. The answer I received is that yes you can apply the Class 3 assembly requirements using a class 2 PWB but the resultant assembly will