Electronics Forum: clean comp (Page 1 of 2)

Universal GSM1 with Shuttle

Electronics Forum | Fri Sep 23 08:27:28 EDT 2005 | siverts

The 7 spindle Flex jet head, can only pick max 7 comps. from the GSM base machine in a single operation, not from the shuttle. The Flex jet head is faster in z-axis and will also use the OTHC (On The Head Camera) to inspect most of Your smaller comps

Re: baked on water soluble flux residue betwwen fine pitch comp.

Electronics Forum | Fri Dec 01 15:37:50 EST 2000 | Dason C

Jim, you may need to look with different paste instead of the cleaning solvent. Please advise what is the paste which you currently using? Beside, when you talking about the board stayed in hot area, is it a drying area or the cleaning zone. If it

Adhesive Dispensing using PDP head

Electronics Forum | Thu Jul 07 14:58:18 EDT 2011 | vickt

Prasad, It is typical when experimenting with new materials to have to adjust the airpressure on the syringe and the stroke of the PDP piston (screw adjust on top of the PDP pump). You can add mutiple cycles in the comp Db to make larger dots with th

Re: baked on water soluble flux residue betwwen fine pitch comp.

Electronics Forum | Fri Dec 01 16:02:33 EST 2000 | Jim M

Thanks for your reply. I 've tried to clarify and answer your questions. The water soluble paste used is WS3060, type 4. The boards are sent through a inline di cleaner after reflow. There is a hot Di waterwash, rinse and then hot air to dry the wa

Air Vac Mini Wave Process

Electronics Forum | Mon Jan 27 12:27:03 EST 2003 | ksfacinelli

We have an assembly that requires a number of high density connectors to be placed after SMD. The process will not allow a normal wave solder setup due to the population of SMD comps. We cannot use a selective solder pallet due to profiles. We are

Found Ceramic Chip Caps to be Short Circuit

Electronics Forum | Thu Aug 24 12:53:56 EDT 2006 | russ

yes, it could have been from all 3 locations. without any detail whatsoever about your process or anythign it is impossible to help!! please check your incoming material prior to processing please check your reflow profile to ensure that max temp

Re: Aperture sizes for printing SMD adhesive

Electronics Forum | Mon Feb 22 12:04:15 EST 1999 | Dave F

| Please could you suggest a recommended aperture sizes for | printing of smd adhesives. Any recommendations on stencil thickness as well as stencil finish will be appreciated. | Mark: About the only rule of printing adhesives is: Keep it off the

baked on water soluble flux residue betwwen fine pitch comp.

Electronics Forum | Fri Dec 01 14:12:50 EST 2000 | Jim M.

My company currently uses water soluble paste for our SMT process. We were having trouble retaining hot water in our in line, closed loop DI cleaner. The cleaner kept shutting down when the water temp. dropped below 125C. As a result, the conveyor

Re: baked on water soluble flux residue betwwen fine pitch comp.

Electronics Forum | Fri Dec 01 17:03:57 EST 2000 | Dave F

Curious, very curious ... Residues � Where are these residues? [solder & laminate / mask, solder only, laminate / mask only] What is the result of your analysis to the residues? How do you know it�s a flux residue, rather than a chemical by product

Re: Printing Adhesive

Electronics Forum | Thu May 06 18:18:15 EDT 1999 | JohnW

| OK, my manager read an article on printing glue (aaargghh!)and wants to know why we aren't doing it. We currently use Fuji GLs and GDMs to dispense glue. I've never done it, but have seen it done at NEPCON and other shows. It looks OK, BUT what

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