Electronics Forum | Mon Jan 19 20:01:11 EST 1998 | Steve Gregory
| We use no clean paste and sometimes experience | flux splattering which gives spot on gold fingers. | Need help in analize the cause. thx. Dominic, That is STILL a problem huh? It's a tough one to solve sometimes...especially when you have as
Electronics Forum | Tue Aug 21 21:39:19 EDT 2001 | davef
1) why is No-clean (NC) the preferred process, for BGA mounting by SMT? Probably the same reason NC is the preferred process for mounting non-area array SMT components. 2) why is water-soluble (WS) not a hot choice? There�s not reason not to use
Electronics Forum | Thu Sep 26 14:03:55 EDT 2002 | Randy V
There are allot of issue to washing that need to be considered before you purchase a washer. But to answer your question regarding ultrasonic cleaning: 1. Ultrasonics with the correct frequency will not damage most components. Washing in general can
Electronics Forum | Thu Feb 10 22:55:50 EST 2000 | Dave F
Fred: I'm tryin' my darndest to be good, because, for whatever stupid reason, I feel that you're making an honest inquiry and not just floating something to find the biggest sucker. If only Earl was still here, he'd always bite on stuff like this.
Electronics Forum | Mon Feb 19 13:04:17 EST 2001 | billschreiber
The ultrasonic frequency used in today�s stencil cleaners is usually a 40 kHz �sweep� frequency (also used on semiconductors and other sensitive cleaning applications). This frequency is not low enough to cause stencil damage (the lower the frequen
Electronics Forum | Wed Mar 14 16:01:39 EST 2001 | Rob Fischer
Not necessarily. Maybe just a little over > sensitive...? > > I though Bill provided > considerable insight relative to the process and > the original question. There was a good answer in > there. I also thought that he provided more > specifi
Electronics Forum | Wed Oct 06 12:03:12 EDT 1999 | Graham Naisbitt
| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n
Electronics Forum | Thu Aug 26 04:35:54 EDT 1999 | Wolfgang Busko
| | | Does anyone have any information on stencil aperture/pad ratios for noclean solder paste. In the past I have experienced severe solder ball problems when using the same size apertures from aqueous products as I do with the No-clean products.
Electronics Forum | Mon Jul 26 12:55:08 EDT 1999 | Rob Fischer
I'm interested in hearing how many forum fans are interested in blatant advertising in the forum pages. At least Mike listed everyone instead of tooting his own horn. Some vendors support sites like these by buying banners and such. How effective
Electronics Forum | Sun Jun 20 06:30:49 EDT 1999 | Scott Cook
| Do anyone have any experience on assembling high frequency product, 1.8GHz or 2.4GHz. | | In our production line, we manufacture 1.8GHz product with using no clean paste (RMA type) for reflow and no clean wire for rework. In our functinal test,eit
