Electronics Forum: cleaned (Page 426 of 601)

Stainless Steel tabs in brd assemblies

Electronics Forum | Thu Jan 03 10:55:17 EST 2008 | davef

Q1: Can Stainless steel be soldered? A1: Yes, stainless steel can be soldered. Q2: If yes, is our normal process adequate? A2: We know nothing about your normal process. Common flux used in routine soldering will not step-up to the requirements nece

Stainless Steel tabs in brd assemblies

Electronics Forum | Thu Jan 03 14:01:24 EST 2008 | fsw

Davef, thnx for your reply. Sorry, forgot to clarify "our normal soldering process". We use standard Sn/Pb & SAC305 for our non RoHS & RoHS requirements. We only have a "No Clean" process, no aqueous flux is used. Hence our flux will be mild. As susp

Micro Solder Balls in No Clean Selective Solder Process

Electronics Forum | Mon Jan 14 06:28:18 EST 2008 | gregoryyork

Hi its normally down to the state of cure of the resist type not the actual type be it matt or gloss. If its not cured correctly it will produce solder balls. Pending where you are you could try our 35-41 or new 35-41-30 flux this will reduce the pro

Micro Solder Balls in No Clean Selective Solder Process

Electronics Forum | Tue Jan 15 10:59:11 EST 2008 | gregoryyork

We did numerous testing some years ago on matte, gloss and semigloss and found after chemical extraction of the PCB and IR analysis the only difference was the actual cure of the resist. The more plasticizers released the worse the balling If you use

Micro Solder Balls in No Clean Selective Solder Process

Electronics Forum | Tue Jan 15 14:03:18 EST 2008 | patrickbruneel

Hi �Pb-Head� I agree with everything you say, except for your statement that alcohol based fluxes perform poorly with convection heat. The fluxes you tried might have performed poorly, but that doesn�t mean that all alcohol based fluxes perform poor

Best Alpha Lead Free WS paste??

Electronics Forum | Tue Jan 15 11:50:17 EST 2008 | pbarton

We too are trialling WS819 with SAC305 alloy. The foaming in cleaning causes us a headache but all other attributes seem much improved over earlier types. Previously we were using WS619 - no foaming issues but MUCH shorter stencil life (less than 4 h

Dirty Reflow owens.

Electronics Forum | Fri Feb 01 02:46:23 EST 2008 | bartlozie

Hello, If I do understand it correct, the dust in your oven are salt-crystals, comming from No-clean fluxes. We had them also once, it was a problem with one fan in the oven, I think you should check your fans inside the oven. Our extraction was OK,

IP3 X1 Encoder Alarm

Electronics Forum | Fri Feb 15 03:38:37 EST 2008 | keithej2

The X1 glass scale reader is bad. After cleaning it didn't help, we removed the read head and took the cover off. There is a cracked component (L1) and magic smoke/dust on the parts around L1. There's also a dead short on the two tiny wires that supp

PastePuck enclosed paste printing system

Electronics Forum | Thu Mar 20 20:57:44 EDT 2008 | rrpowers

Well, we are in fact doing a no-clean, multi-shift, very high volume, minimal changeover operation. We use up any paste long before it gets old. Because of the sheer volume any reduction in paste scrap for us is big money. We also are in a zero de

Solder Paste

Electronics Forum | Thu Mar 20 09:55:11 EDT 2008 | swag

We have a class 3 SMT build that requires the paste conforms to J-STD-005 RE LO. We have not used a low activity flux in the past and would prefer not to have to change our wash process or change to no-clean paste for these builds. I have researche


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