Electronics Forum | Thu Oct 22 14:44:18 EDT 2020 | greasemonkey
I have recently taken charge of a hesse bondjet BJ820, I have zero experience of bonding before this and to be honest, Im finding it troublesome to say the least!! basically wire keeps snapping. I would like to set the head up from scratch but the ma
Electronics Forum | Tue Jan 12 21:22:48 EST 2021 | processman
Hello all Tommy you are very close to how we measure. Also other replays and info very interesting to read as I too see these problems with playing with numbers and wasting time on issues of no concern. We record all data on ASM siplace explorer
Electronics Forum | Wed Dec 09 18:51:06 EST 2020 | johndep7
My company has been having issues with a lot of solder balls, solder splash, and flux balls all over a specific board. Now this is one of the only companies that require us not to clean our boards after our work is finished but this is also causing a
Electronics Forum | Thu Jan 07 14:11:08 EST 2021 | dontfeedphils
What is everyone using for assembled circuit board/finished good storage? I'm looking for ideas. Most of my assemblies will have some sort of wire pigtail soldered to one side of the PCBA, so they won't sit "flat", and I'll have a large enough vari
Electronics Forum | Fri May 28 13:19:31 EDT 2021 | cbart
I can't see the image very well, but from what i see it looks like oxidation. looks like an ENIG finish on the board, possibly a plating issue from the bare board house, thin gold or the nickle is to thick. one other question i would get an answer t
Electronics Forum | Thu May 06 19:21:24 EDT 2021 | markhoch
Verify your aperture reductions in the stencil. Are the solderballs always in the same location? Same size & shape? Is the solder leaching through plated thermal holes from the opposite side of the PCB? Are you using stencil apertures designed to min
Electronics Forum | Tue Jul 13 16:29:25 EDT 2021 | stephendo
I didn't see that but I was thinking he could sprinkle it with holy water and repeat in a loud firm voice, "the power of Christ compels you". Or he could find an IT forum instead of a manufacturing one where our printers use a stencil and print bric
Electronics Forum | Mon Sep 20 20:43:19 EDT 2021 | ttheis
One of our GSM machines started having an issue with "spitting" parts onto the board / blowing them around. I determined the problem be that spindle #2 on our flex head is not touching the parts all the way down to the board. It is stopping just abov
Electronics Forum | Thu Mar 31 11:13:33 EDT 2022 | jzeivel
I forgot to mention in my original post, I actually replaced the theta belt and cleaned the head. All the tools rotate as they should. When I run the burn-in I get no errors. I can run the "test sub-systems" on the head in the service program and
Electronics Forum | Mon Apr 18 12:14:39 EDT 2022 | proceng1
As far as hole fill, as was stated above, class 2 only requires 50% up-fill. In order to get better up-fill on the initial pass, you may need to consider more pre-heat. Also, better application of flux. Are you using a drop jet, or a spray? You
