Electronics Forum | Wed Jul 21 17:49:52 EDT 2004 | jsk
problem: Too many solvents and boards are not clean Flux remains on the board after vapor degreaser and "Powdery" white residue after vapor degreasing Flux type is kester 186 Process: hand solder High Temp alloy, spot clean after hand solder e
Electronics Forum | Tue Aug 03 18:11:21 EDT 2004 | davef
Improper washing of water soluable flux residues can be a major contributor to flux residues remaining on the board surface. ;-O That you appear to be only complaining about the pathetic state of the ability of your washer to clean under BGA, it may
Electronics Forum | Sun Aug 29 19:17:34 EDT 2004 | aqueous
Chen, It is always best to place one�s effort on determining the cause and content of the residue rather than trying to work around it. The first thing you must determine is the nature of the residue. Is it flux? In many instances, the residue is
Electronics Forum | Sat Sep 18 12:10:19 EDT 2004 | Steve Gregory
I have a question about solder masking via's in a BGA pattern, and want to see if I'm thinking correctly about this. This problem is kind of along the same line as Carol's problem earlier. I think it's a bad idea to leave the via's free from solder
Electronics Forum | Tue Mar 15 18:42:57 EST 2005 | simmcircuits
Hi, Can anyone give me a bit of an advise or tip on how to reduce the flux residues on the board when it comes out of the wavesolder machine. The Vitronics Soltec 6622CC that we are using have been producing boards like this for years and people her
Electronics Forum | Tue May 03 22:53:54 EDT 2005 | MikeaJ
I 100% agree, KEN is absolutely right. If your machine is equipped with a stencil cleaner, and it is the original SMTech USC with the full length bar, you are in trouble already. If your software is of an earlier vintage, upgrade ASAP. Anything less
Electronics Forum | Mon Jan 30 16:30:55 EST 2006 | GS
Hi James, it could be the problem is due to residual of cleaner media entrapped under low gap of QFP 208 and 0,5 mm lead pitch. I remember in the past we had random problems of failure at test after board wash off process (DI Water wash). We met
Electronics Forum | Mon Jun 19 22:19:40 EDT 2006 | Nathan
Dear All, We plan to setup an assembly line for our small volume production of PCBs (about couple hundred PCBs per week). The board has about 150 components (less than 30 types) and a few BGA and IC (majority is SMT, only few THT connectors). We hav
Electronics Forum | Wed Nov 01 11:30:49 EST 2006 | slthomas
Dave, your points certainly have merit and I wouldn't make a habit out of that method. We did it only because there were a lot of parts dependant upon chipbonder and we didn't think they'd all survive an ultrasonic cleaning, functionally or physicall
Electronics Forum | Wed Mar 28 09:32:27 EDT 2007 | realchunks
Solder iron robots tend to miss solder joints from time to time. The wire feeder systems are the key to these machines. Most use the edge of the board for alignment is another reason they miss. If you have SMD close to the thru-hole, the robot may
