Electronics Forum: cleaning process (Page 171 of 202)

Quad C Series Linear Bearing Lubrication

Electronics Forum | Tue Sep 19 22:45:19 EDT 2006 | darby

Larry, The Quad is based on the Samsung - yes? If so, here are the final recommended answers from Samsung. All LM guides and bearings, ball splines and rack and pinion use Shell Alvania EP2. Sometimes called LF2. Sometimes called Albania. It's a dar

Re: BGA Repair Problems

Electronics Forum | Mon Aug 17 02:50:44 EDT 1998 | Bob Willis

| Have an SRT w/preheat, 18 layer board all copper, 456 BGA needs to be removed and replaced. The manufacturer is Chip Express and during reflow it warps up or down. Causing either opens or shorts on the corners. I was using gel flux with multiple

Re: Solder Paste from 500 gram tubes.

Electronics Forum | Wed Jul 21 11:49:24 EDT 1999 | Deon Nungaray

| | | | I recently switched from solder paste in 500 gram jars to 500 gram tubes. I did this to try to limit the time the paste is exposed to the room environment. But we have a need to clean the stencil every 4 - 5 boards which means taking the bulk

Re: SRT BGA Rework

Electronics Forum | Fri Dec 18 22:20:41 EST 1998 | phillip hunter

| I have developing a BGA Process and having problems with | 310 IO PBGA reflowing. I am achieving good wetting exept | 2 to 5 balls on the outer perimeter I have a good profile | my air flow is set per mfg spec, the stange thing is that | it doe

Re: SRT BGA Rework

Electronics Forum | Sun Dec 20 20:40:22 EST 1998 | Miguel Mariscal

I would love to send a copy of my profile thanks, our machine is also a Summit 2000. | | I have developing a BGA Process and having problems with | | 310 IO PBGA reflowing. I am achieving good wetting exept | | 2 to 5 balls on the outer perimeter

Re: Ionic contamination

Electronics Forum | Mon Jul 10 21:01:06 EDT 2000 | Dave F

Edmund: Responding to your questions: 1 What is purpose of using DI water to wash a PCBA? Compared to tap water, DI water is less likely to leave: � Metal cations on sensitive components. � Salts of Ca, Mg, and other stuff on metals on the assemb

Re: Tin-Lead thickness on PWB's/Let's Hear More

Electronics Forum | Thu May 28 07:25:58 EDT 1998 | Earl Moon

| Hey yooze guys! | Enough of the jokes between you and Earl (GRIN), let's get back to the topic...well, okay... you can tell a few more...(but good ones, 'kay?) | Anyhoo...I'm not sure if ya'll are on the IPC Technet list or not, I've not seen any p

Re: Tin-Lead thickness on PWB's/Let's Hear More

Electronics Forum | Thu May 28 05:43:33 EDT 1998 | Earl Moon

| Hey yooze guys! | Enough of the jokes between you and Earl (GRIN), let's get back to the topic...well, okay... you can tell a few more...(but good ones, 'kay?) | Anyhoo...I'm not sure if ya'll are on the IPC Technet list or not, I've not seen any p

Re: Cracking Capacitors and Solder Balls

Electronics Forum | Mon Jun 08 15:29:17 EDT 1998 | Gary Simbulan

| Earl, et al, | Boy things get old and cold around here fast. I promised more detail on my capactior problem and I thought I could drop something completely different in the same message and tell a tale of solder balls. | First the caps. We stil

Re: Lead-Free Processing

Electronics Forum | Thu Jul 20 13:28:13 EDT 2000 | Bob Willis

On all the trials I have done I have made no changes to the stencil thickness or apertures than the normal changes we make for our process. I have not changed any thing in terms on volume of solder for more reliable joints. I fact I have not read any


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