Electronics Forum | Wed Jan 20 14:28:50 EST 1999 | Dave F
| I have a severe problem with flux residue being drawn up the vent ducts of my reflow oven. This residue reaches a critical mass then begins to flow down the ducts and becomes very messy. I run a no-clean process and use IR oven. Has anyone else o
Electronics Forum | Fri Jan 16 23:46:38 EST 1998 | Scott
| I have a problem! The solder on my pc boards look great comeing out | of my reflow oven. They go thrue the rest of the prossese | and at the end at the qc station it's cold or whitish or gray not shiny. | does any one have a idea on how to correct
Electronics Forum | Fri May 17 03:04:15 EDT 2002 | Mike Konrad
This conversation reminds me of the old �How Many Engineers Does It Take To�� joke. We manufacturer the ionic contamination (ROSE, SEC) testers and I am not aware of anyone that performs such exacting surface area calculations. Most people use th
Electronics Forum | Mon Apr 28 09:59:04 EDT 2003 | davef
Your customer's question is reasonable. Soldering to nickel is not always a walk on the beach [can of corn, or whatever]. This issue is flux not solder. Your Sn63 will have plenty of strength, providing the solder connection is well formed. You s
Electronics Forum | Tue Dec 21 11:46:29 EST 2004 | KEN
Are you adding liquid flux? Or paste "Gel" flux? If liquid flux: This, in my mind, is an unacceptable technique. Why? 1. Can not control metals content. 2. Probably not adding the same chemestry flux...as paste flux has many different addi
Electronics Forum | Wed Feb 23 17:24:06 EST 2005 | Austinj
Solder spattering, solder balls, components "popping" off pads........ Not a serious chemical reaction, however, as replied to by KEN on 12/21/04 in a similar article: "Are you adding liquid flux? Or paste "Gel" flux? If liquid flux: This, in my m
Electronics Forum | Tue Feb 14 22:48:06 EST 2006 | Cal Kolokoy
That is a tough situation and a tough answer for us SMT forum participants. After all, most of us are in the business of placing and soldering components to circuit boards, and you know the saying; you can't make solder joints with an unsolderable su
Electronics Forum | Thu Oct 05 16:04:00 EDT 2006 | GS
I am not expert, just my comment, the total ionic contamination allowed after SMT, by using No Clean process, theoretically it should be close to Zero. Any way the Standard IPC-JSTD-001 allows 1,56 ugr NaCl/cm2 for the final Printed Board assembled.
Electronics Forum | Mon Feb 11 15:15:09 EST 2013 | rgduval
I'm working on installing a batch washer, and am looking into water heaters to support the cleaning process. I'll be installing a DI system, and I know that stainless steel tanks are needed due to the corrosive nature of DI water. My DI system inst
Electronics Forum | Wed Jun 18 18:58:10 EDT 2014 | ke6zoy
Hi All, We leadform components for our assemblies in house and have been tinning the leads using a dip methood by hand into a solder pot. by just handling the components during the tinning and cleaning process we are at times damaging the parts/lea
