Electronics Forum | Sun Jan 31 23:03:57 EST 1999 | Dennis O.
| | hi, | | i am working towards developing a no-clean process for a customer at contract manufacturing facility. the assemblies have gold fingers on them. these are masked to prevent from any damage to them during reflow soldering. the earlier pr
Electronics Forum | Tue Jun 14 17:32:44 EDT 2011 | davef
It depends on the flux and the down-stream processing ... * If there is adequate down-stream cleaning: We are ambivalent. * If the flux is low residue and there in no down-stream cleaning: We don't like using a syringe because it squirts liquid flux
Electronics Forum | Mon Aug 26 20:31:34 EDT 2002 | davef
Yes, it is quite common. Does it [refraction] provide adequate resolution? => Depends on: * What you mean by �adequate�. * When during the process [cleaning solution life] you make the measurement. Is the [refraction] measurement affected signifi
Electronics Forum | Tue Feb 03 16:42:50 EST 2009 | cuperpeter
Hello All, > > I have a problem with nonwetting Au > finish after second cycle of reflow soldering > doublesided boards. Solder nonwetted pcb pads (is > wicked to component terminations) Either these > pads or some of non component pads became
Electronics Forum | Fri May 23 04:22:39 EDT 2014 | andrzej
Thanks Hege. I've done some research and this might be the root couse: 1. Too thin HAL layer which leads to formation intermetallic Cu-Sn layers on surface after 1-st reflow (most probably) 2. Poor quality of solder for HAL process. 3. Problem
Electronics Forum | Wed May 26 15:02:40 EDT 1999 | Paul Bonstrom (SGI)
Looking for help in finding suitable high temp gasket for use in smt assy support application. Gasket used to restrain flex on smt module in area prone to localized heating due to nearby device removal (hot air). Current gasket mtl (neoprene) degra
Electronics Forum | Fri Apr 09 20:47:36 EDT 2010 | 89jeong
I think the oxidation on the pad happens easily but do not on Au plated pad.The reason may be caused by improper cleaning or Au plating thickness in plating process. But,before suspecting the pcb board, you need to check your process or used material
Electronics Forum | Sat Oct 17 10:50:11 EDT 1998 | mike
| | | All Y'll | | | | | | How do you clean components that must be added to an assembled board after water wash? | | | | | | BACKGROUND | | | | | | Our basic process goes like this: | | | | | | 1 Print paste with OA flux, place, reflow, wash |
Electronics Forum | Mon Jul 05 18:45:01 EDT 1999 | JohnW
| Is the no clean solder paste as good? We are wondering if we can elliminate the wash when we change from through hole to surface mount. | John, No clean is as good as your process, and the paste you are using. Everything I do is no clean and I h
Electronics Forum | Wed Mar 12 08:03:30 EST 2003 | Surachai
Hi all Pls. help advise. Our board use RMA solder paste (Pb-free Sn96.5/Ag3.0/Cu0.5). Can we use No-clean paste flux (Delta 670S1) in rework process? If it can not be used, why?. Thanks very much for your advice. Surachai
