Electronics Forum: cleaning bga solder balls. (Page 1 of 137)

mirco bga stencil opening

Electronics Forum | Thu Sep 12 10:45:29 EDT 2002 | pbarton

We have used a laser cut stencil 0.15mm (0.006") thick with 0.3mm (0.012") square apertures radiused in the corners 0.06mm (0.0025") to aid paste release. This approach with the (type 3) paste we use has proven successful on thousands of devices plac

bga reflow in water clean solder

Electronics Forum | Tue Apr 27 08:14:59 EDT 2004 | iqbal

Is anybody doing BGA soldering water clean solder. If yes how you are ensure cleaness. We have boards with Four BGA and 2000 chip and ICs.We are processing with no clean solder but we are getting bad wetting so now we are planning to switch to water

bga reflow in water clean solder

Electronics Forum | Wed Apr 28 22:35:32 EDT 2004 | davef

We can clean the blank out of LARGE BGA. [Cleaning small BGA is a whoooole nuther issue.] But before we get into that, what's the problem and its breadth? Why are you getting poor wetting? What's the story on the components, board, process materia

Flux residue cleaning procedure

Electronics Forum | Mon Oct 30 20:24:35 EST 2006 | davef

As we understand it, you: * Get some nice BGA from your supplier * Find BGA to be packaged properly * Bake the BGA for 24 hours at [what temperature?] to reduce the potntial for damaging moisture sensitive components during following processes * Remo

BGA underside cleaning

Electronics Forum | Thu May 07 08:31:13 EDT 1998 | Alan Pestell

We are about to use BGAs on our equipment. We clean all products prior to confomally coating them - to keep moisture off the IC legs. Will this be a problem with BGAs. Will we need to get the coating underneath the BGA or will the pitch on the balls

ultra sonic cleaning

Electronics Forum | Wed Jul 02 03:12:31 EDT 2003 | Joanna

We have been having problems with solder paste balls around fine pitch ICs and have decided that cleaning the boards in an ultra sonic cleaner may reomove these solder balls. However we are worried that the ultrasonic cleaning process may damage the

Re: BGA underside cleaning

Electronics Forum | Thu May 07 15:56:43 EDT 1998 | Terry Burnette

80ppm). The CTE of your board and solder joints will typically be 18-22ppm. We have seen cases were the coating fills the gap between the component and the board, then during temperature cycling the coating expands to the point of breaking the solder

oil contaminated PCB cleaning

Electronics Forum | Sun Jan 31 18:05:30 EST 2010 | davef

Questions are: * What kind of oil is this? Where did it come from? * In olden days, we used to pour oil on the wave solder pot to limit dross formation and loosen-up the solder. Miss that stuff, sigh. * Is there oil under the BGA? It's surface ten

Flux residue cleaning procedure

Electronics Forum | Tue Oct 31 21:49:38 EST 2006 | davef

First, we assume the white residue is only on the connector and not on other components. That would imply that either: * White stuff was on the connector when it came in-house from your supplier. [Confirm this theory by baking some connectors from

BGA site cleaning for rework

Electronics Forum | Thu Apr 10 11:57:19 EDT 2003 | stepheno

We recently had to replace some BGA's. The replacement ones did not work, and when removed there was residue. Unfortuneatly I didn't get a chance to see the residue. It was described as "fuzzy and grungy". The pads had been cleaned with solder wi

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