Electronics Forum | Tue Aug 23 09:02:12 EDT 2005 | Bob R.
There are several methods in IPC-TM-650 depending on whether you're testing for the effect of flux residues or board cleanliness. They're available for free download here: http://www.ipc.org/contentpage.asp?PageID=4.1.0.1.1.6
Electronics Forum | Mon Jan 09 07:56:49 EST 2006 | slthomas
Squeegee pressure or height, snap off, the age and/or condition of the paste and the condition/cleanliness of the stencil are about all I can come up with, unless you got a new stencil and you changed the design parameters or they made it wrong.
Electronics Forum | Wed Jul 05 07:44:36 EDT 2006 | davef
IVF Research Publication - "Cleanliness and Reliability: Evaluation of Test Methods and the Impact of Contamination from the Production Process on the Reliability of Printed Circuit Board Assemblies"
Electronics Forum | Wed Sep 27 20:11:19 EDT 2006 | davef
Help us understand your question better by answering the following: * What is a 'used PCBA'? [Are these boards returned from a customer?] * What is on these boards that needs to be cleaned? * How clean do the boards need to be? How is this cleanline
Electronics Forum | Thu Nov 02 07:45:15 EST 2006 | davef
For more than you want to know about static and dynamic testers, read EMPF report RR000013, "An In-Depth Look at Ionic Cleanliness Testing". Request it from http://www.empf.org/index.html#
Electronics Forum | Fri Dec 15 12:37:23 EST 2006 | Gman
Got my answer. Thank you. Several postings on this forum from quite a while back!
Electronics Forum | Fri Sep 14 08:24:19 EDT 2007 | davef
Sure, it's possible to transfer water soluable flux from boards to tray to boards with low residue flux. We have never heard of this try of problem.
Electronics Forum | Mon Oct 22 08:54:27 EDT 2007 | rgduval
Michael, You're right, of course. A major mis-type on my end. What I meant to say is that no-clean fluxes are designed to not _require_ cleaning to meet industry cleanliness standards. Cheers ..rob
Electronics Forum | Mon Jan 21 16:13:50 EST 2008 | arun2382
We see delamination at Mold compound to substrate interface when tested for MSL3. We haven't tested the substrate for cleanliness. Can you please suggest methods for this? thanks, arun
Electronics Forum | Fri Apr 04 14:54:19 EDT 2008 | alexs
Thanks for the reply. Just one more question. If there is less solvent but the residues are harder to clean. would there be more contaminant left on the boards? Has anyone did a cleanliness test?