Electronics Forum | Thu Jul 28 21:54:25 EDT 2005 | Ken
1 us gallon = 231 in^3 (NIST) 1 inch = 2.54 cm 1 in^3 = 16.38cm^3 16.38 cm^3 X 231 = 3785.41 cm^3 1cm^3 = 1g (pure water) 3785.41 cm^3 = 3785.41g or 3.785.41Kg Do I get credit for showing my work?
Electronics Forum | Thu Sep 25 12:59:14 EDT 2003 | successmani
hi, I am a research student in Electronics manufacturing at RIT. We are planning to assemble boards using lead free solder paste. I was wondering would there be any changes in printing in using lead-free paste"Sn-3.9Ag-0.5Cu". Thedensity of Sn-37Pb
Electronics Forum | Sat Jun 03 00:52:07 EDT 2017 | claire_08
sugget one company, 3cm * 3cm board, now have promotion just $5 sure good quality, as more than 20 years experience. do you want to try?
Electronics Forum | Mon Mar 19 08:26:37 EST 2001 | hany_khoga
Dear All: We have a problem of soldering big BGA's (3.5Cm * 3.5 Cm)during rework or repair. With three big companies stations (hot air & infrared) with their support, they faild to re-solder even one BGA succesfully. Note that we workes on a good te
Electronics Forum | Thu Aug 26 21:54:57 EDT 2004 | KEN
I ran into this about 2 years ago. The Rework Operators (all 3 shifts) would rework a device, rince the board with tap water (yep, 50k / Cm^3) from a nearby sink, then send the PCB to test (which is really ironic as they had to walk past the DI wash
Electronics Forum | Thu Sep 02 23:14:33 EDT 2004 | KEN
Not sure of what a bench top DI setup would look like. I use 3.5 Cubic foot tanks but have a special application that uses a 1 cubic foot tanks....even then its not a bench top setup. What is clean. No one can tell you. YOu can use IPC TM650 or t
Electronics Forum | Thu Nov 23 04:58:55 EST 2023 | klauss
We have 30 LED PCBs. Only differences between them are size and led counts. there's about 10cm (3.9inches) between smallest and largest board. and leds start from 60 to 80 pcs. and all leds are the same My question is that, do i have to set 30 diffe
Electronics Forum | Wed Nov 07 17:11:14 EST 2001 | davef
1 CAN WAVE SOLDER AFFECT OR DAMAGE BGA? Sure. Since you are vague, assuming: * Partially assembled board was not stored to prevent moisture absorption. * BGA is in a plastic package. * Partially assembled board was stored long enough to exceed th
Electronics Forum | Sat Jan 06 21:56:54 EST 2001 | Greenman
While solder paste height is one possible process indicator, the other guys are right on the money - volume is key. One way to study overall paste volume is to measure every single pad, using a 3D laser analysis (see you next week for board 2)... OR
Electronics Forum | Wed Sep 12 18:11:03 EDT 2001 | davef
First, what on the area array package are you analyzing � * Package cracking? * Cracked solder balls? * Er, what? Second, most failure analysis discussions consider dye penetration to be a non-destructive test, but then again most failure analysis
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