Electronics Forum | Sat Jul 21 00:38:46 EDT 2001 | dougk
Where did this come from? I hope our safety director doesn't see this or I'll have more work to do. Seriously, if is bacterial contamination, it would be lysed immediately on contact with the iron. We ask our operators to wash their hands after handl
Electronics Forum | Tue Jul 31 22:42:41 EDT 2001 | chip
In the past I have spoken to Multitronics sales reps and looked into the product line. I saw their equipment more suited for a smaller "mom and pop" type shop, I work for a mid size contract house and it wouldn't have come close to meeting my needs.
Electronics Forum | Mon Aug 13 16:44:43 EDT 2001 | seand
Hello Hussman, Sorry about the misplacement of my strand on yours. I was just posting to the very end of the conversation at the time. My statements were not aimed at you or at sales in general. Just trying to show that not all of us in sales are
Electronics Forum | Thu Feb 10 16:00:31 EST 2000 | Travis Slaughter
I have had cases when it was necessary to run epoxy and paste at the same time. The only good reason I know of to even think about messing with going to this trouble is if the surface tension of the solder melting pulls the part out of alignment. T
Electronics Forum | Sun Jan 23 03:07:16 EST 2000 | Robert Steltman
We are experiencing 2%+ dropout on one particular SOT23 device. This seems to occur during the actual pickup phase. I have made sure that my pickup position and height are correct. If I single step through the forward feed of the component, viewing i
Electronics Forum | Fri Jan 14 10:11:45 EST 2000 | John Thorup
I'll have to go along with Wolfgang as having a good experiance with frameless. We have been using a system from IIT in California for about a year. I was sceptical at first because of this system's X only tensioning but it does work. We use mostl
Electronics Forum | Tue Dec 28 12:26:22 EST 1999 | Christopher Lampron
Rick, Does the ultrasonic cleaning system that you use reuse the same water for each cleaning cycle? I have had a similar problem in the past using a Brandson ultrasonic cleaner and water soluable flux. The problem was the buildup of flux in the clea
Electronics Forum | Tue Dec 07 20:07:21 EST 1999 | Dave C.
Thanks for all the info Dave. It's the interconnect between the copper foil pad and the eutectic solder ball that I'm most interested in. The BGA in question is very thin gold plated over nickel over the copper. When we are reworking the BGA, i
Electronics Forum | Wed Dec 01 10:14:41 EST 1999 | Wolfgang Busko
Hi Steve, the "framepiece" I mentioned may be misunderstanding but sometimes I don�t know the common english expression. What I meant is if the PCBs do not come in panels (now you mentioned 3-up panel)the PCB supplier could add additional material to
Electronics Forum | Tue Nov 09 05:14:49 EST 1999 | Wolfgang Busko
Hi all, our problem we face is the mismatch of conductor width on the delivered PCB and the nominal width given by CAD-data. With CAD we are improving pads and conductors to match the specific needs for soldering and the board houses counteract our i
