Electronics Forum | Thu Mar 22 17:38:44 EST 2001 | davef
OK, lemme take a different angle on this, �cuz I forgot to touch on this when I first responded. I mentioned a study ["Evaluation of Low Residue Soldering for Military and Commercial Applications: A Report from the Low-Residue Soldering Task Force"
Electronics Forum | Tue Apr 03 22:03:18 EDT 2001 | davef
With friends like you, who needs enemies? I�d guess that the perceived benefits of flat pads for your 20 mil pitch and below components counter-balance the higher cost, gold being a solder pot contaminant, limited solder mask compatibility, potentia
Electronics Forum | Mon Apr 29 09:58:38 EDT 2002 | pjc
Machine Data Mydata MY9 machine weight: 1800kg placement repeatablilty @ 3 sig: 15 micron x-y axis drive mech: x combo belt rackπnion, y ball screw Siemens F5 machine weight: 1500kg placement accuracy @ 3 sig: 30 micron x-y axis drive mech: x belt
Electronics Forum | Tue May 01 12:16:25 EDT 2001 | kaoni
I really appreciate your advice. Dave did not offer much in the way of real advice, his response was mostly diatribe. I am looking at visual inspection at this time as AOI might be overkill in my case. I believe that it, in combination with the machi
Electronics Forum | Tue Nov 28 12:00:33 EST 2000 | rabell
Deon, my first response is YES - big time. You are correct that there are some massive issues here. For one thing, lead free solders are only one solution, as conductive epoxy has also been put forward. This was demonstrated on the TAC line at Ne
Electronics Forum | Fri Jun 23 20:45:12 EDT 2000 | Lee
Hi Dave, You make a very good point. I think that the concern over lead is not so much in user's contact with the lead during the product's active life, but after its disposal. There is some valid concern over lead leaching out of circuit boards
Electronics Forum | Tue May 08 19:28:29 EDT 2001 | mparker
Received my copy of the standard about a month ago. Seems straightforward and gets away from the percentage nightmare. Mark Twain said it best with "There are 3 kinds of lies in this world - lies, damn lies and statistics!!" Now I have some nagging
Electronics Forum | Wed May 09 12:07:52 EDT 2001 | caldon
My personal favorite is the Siemens F series and the UIC GSM platform. Both Siemens and UIC have awesome resources for csp, flipchip and baredie processing - Siemens= Dan Baldwin from GaTech; UIC = George Westby from UIC labs. My second choice would
Electronics Forum | Wed May 16 10:37:34 EDT 2001 | davef
Similar to my response to your previous posting on this topic dated 5/8/01, things to try are: 1 Contact your non-supplier [Streckfuss] using the contact points at http://www.streckfuss.com/wave_soldering.htm, obtain source drawings for components o
Electronics Forum | Tue May 22 17:24:12 EDT 2001 | davef
What is your thinking on the issues surrounding design and manufacture with leadless leadframe [eg, land grid array, micropak] components beyond those in http://www.national.com/ads-cgi/viewer.pl/an/AN/AN-1187.pdf? The curve ball that we just looked
