Electronics Forum: component (Page 1076 of 1140)

Design of experiments 2E2 help!

Electronics Forum | Thu Aug 20 13:59:42 EDT 2009 | dcell_1t

Hi there! After various trial-error experiments we determined that two factors are the most insignificant in order to reduce or make worst the issue, those factors are: Placement force: regular placement vs "force applied" to dip the component on th

Component price database - which or how?

Electronics Forum | Thu Aug 27 23:51:10 EDT 2009 | leadthree

I have a little problem. We are assembly subcontractor and we purchase most parts ourselves. Currently we have all BOM/Partlists in an Excel format. We get a few RFQ each month, prices come from well known original sources, Mouser, Digikey etc. and

Researching placement machines - where do I start?!

Electronics Forum | Mon Nov 09 09:18:09 EST 2009 | meritajs

I absolute agree with Adlsmt that your subcontractor was slipshod worker. It’s impossible for normal subcontractor make such fault. For last 15 years I worked for subcontractor firm here in Riga Latvia. Our company was not very advanced. As I said be

Researching placement machines - where do I start?!

Electronics Forum | Thu Nov 19 13:01:40 EST 2009 | deanm

I'm assuming that 18k components per month represents less than 100 boards per month. I've worked for both OEMs and CEMs and if your design is stable and your volumes are relatively stable I would highly recommend going with a CEM given the low volum

BGA Voiding for RoHS

Electronics Forum | Mon Nov 09 07:21:02 EST 2009 | CL

Good Morning, I have seen many posts regarding BGA voiding being excessive and what can be done to better the condition. I have a customer that has an assembly that we have had a diufficult time with. We have spent a lot of time debugging the proces

BGA Resistor Array Separating from Balls

Electronics Forum | Mon Jan 18 10:49:22 EST 2010 | pcbrookie

Hello all, One of our resistor arrays is becoming detached from its balls after reflow. This is the second instance of this happening. The balls are clearly soldered to the board, but the actual package is coming off (package pads are quite bare).

Implementing AOI

Electronics Forum | Wed Mar 03 14:16:59 EST 2010 | davef

First, we expect that your equipment supplier would help you with this. Then again with lots of used equipment flying around, some of the basic stuff often gets pushed to the back of the bus. Second, here is a clip and paste on the basics of equipm

AOI usage

Electronics Forum | Tue Mar 23 10:46:48 EDT 2010 | oeidave

Hello Sibbe, Thank you for posting your questions. There are a few approaches to AOI with the majority being program driven. There are a couple of systems that are simply comparative in that you use the system to compare a golden board to others th

ICT and specifying PCBA testing

Electronics Forum | Tue Mar 23 07:35:42 EDT 2010 | jooh

Since I'm new to the forum I probably ask previously answered questions (that I have not found) but I would be grateful if someone could clarify this for me. I'm in R&D at a company where we design low volume (1k-10k) fairly complex PCBAs for our pr

PCB trouble shooting

Electronics Forum | Thu Aug 12 13:03:06 EDT 2010 | dyoungquist

Schematics help you troubleshoot further but if you do not have the ability to power up the board, you are limited in how far you can go with your troubleshooting. One solution to this problem we have used is this: The customer agrees to pay for 99


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