Electronics Forum | Fri Oct 21 05:20:12 EDT 2005 | Rob
Hi Jessie, Wrong market - we print solder (or glue) onto boards in 3D, then place components into it, then put it through a very hot oven, for it to liquify, then solidify, fixing the components to the board. Good luck with your venture, Rob.
Electronics Forum | Mon Dec 06 16:54:38 EST 2004 | Gopinath A
Hi, I understand that solder dipping of gold plated units (PCB or component lead) is not the ideal solderability test (leaching of gold in the solder bath being one reason). Would anyone have recommendations as to the ideal solderability tests for g
Electronics Forum | Thu Dec 16 16:19:30 EST 2004 | Indy
If your components are moisture sensitive you might want to browse through J-STD-020C.. Its the test procedure for MSL components
Electronics Forum | Fri Jan 14 12:59:07 EST 2005 | Dan Mendoza
I have used the rectangle shapes and round shapes with no noticible difference. The idea is to design the pads to accept the same solder volume per component. Components over two size pads will favor the higher solder volume side during reflow.
Electronics Forum | Thu Feb 10 08:57:35 EST 2005 | etienne
I want to know how is your feel to buy components in 13" reels rather than in the 7" reels. Obviously enough is that machines will stop less for replenishment, but what about the value of the stock?? What is your comment?
Electronics Forum | Tue Apr 05 12:45:01 EDT 2005 | cyber_wolf
Make sure your matrix tray is up high enough. The components in the matrix tray should be at least at board level. Also check your component height in the package list. If all that is OK then, check those Z locks I spoke of earlier.
Electronics Forum | Tue Apr 12 20:35:30 EDT 2005 | Thaqalain
What these stands for: 0603 and 0402 component package, is there any standard or chart to know what these numbers referred to/corresponding sizes?Please include other packages and paste complete chart/table with reference standard.
Electronics Forum | Thu Apr 14 12:33:30 EDT 2005 | russ
Have you checked the component height in the package data to ensure that it is the same? how about the PCB itself, could there be some warp or twist thay may cause the component to be dropped onto the board? any support problems? this is all I can
Electronics Forum | Mon Apr 18 13:10:33 EDT 2005 | paulhaines2000
I need to load SMT tant. capacitors into sticks for a special placement application on a GSM for track presentation. Does anyone know a company that mfg's custom tubes/sticks for SMT components?
Electronics Forum | Sat Apr 23 11:41:27 EDT 2005 | Dhanish
Biggest SMT issue we encounter in our production floor is Damaged Component,we have implemented a lot of action items but the reject is not declining.Can anyone suggest any special action taken to resolve this problem at your facility.
