Electronics Forum | Fri Aug 04 06:27:15 EDT 2006 | CL
Good Morning Everyone, We have started limited production runs of RoHS assemblies. Most of them are prototypes for our customers that are converting to Lead Free. We have seen on several assemblies, solder beads under the chip components that are en
Electronics Forum | Thu Nov 09 22:21:18 EST 2006 | John S.
I would think it would be more productive to compare DPMO. Particularly across different products. A simple board of 20 components should yield much higher than a complex board of 200 components. Also, some consideration should be given to the dif
Electronics Forum | Thu Dec 07 14:28:25 EST 2006 | russ
Bad design if you have to have a perfect 1206 part. you will always have a lift of some sort when reflow soldering. Solder is 3 dimensional, therefore you cannot get any underneath component, thus eliminating the automated SMT process. Cannot glue
Electronics Forum | Wed Jan 03 09:59:52 EST 2007 | Jim
Hi, I was looking for information on failure rates for BGA components. I am analyzing our BGA rework rates and find it difficult to define a root cause when a remove and replace of the BGA component corrects the test errors. Inspection prior to re
Electronics Forum | Wed Jan 31 17:57:07 EST 2007 | blnorman
We've had multiple issues with non-wetting components. You say only one part is not wetting? Profile won't be the culprit, if so you would have more part issues. We've used SnPb with lead-free parts for some time now, no issues. The issues we had
Electronics Forum | Tue Feb 06 13:24:31 EST 2007 | stepheniii
Good afternoon, > > You have to use lead paste > since none-RoHS components won�t withstand > elevated temperatures. Solder paste manufacturers > offer a lot of transitional pastes designed > specially for mixed process. Ask your paste > suppli
Electronics Forum | Wed Feb 28 08:55:03 EST 2007 | John S.
We've been considering adding reflow, MSL, and other "process" specifications to our component drawings. Presently, we have a review process for component compatibility. Does anyone else try to enforce these specs? Has your experience been that th
Electronics Forum | Wed Mar 21 11:52:56 EDT 2007 | slthomas
Mark, the only Panasonics I've worked with were MSHIIs and an MPAV2B and at this point I'm foggy on both, but both tracked component inspection errors quite well. You should be able to tell how many parts are rejected for thickness inspection errors
Electronics Forum | Wed Mar 28 20:35:52 EDT 2007 | darby
Quadalign is very similar to the Samsung. I would think that 4% dump on 1206 or even IC is way over the top. If you are certain that your component data is correct; I suspect that your z-axis centring height may be out of whack and that you are eith
Electronics Forum | Thu Apr 19 11:45:34 EDT 2007 | Cal
Hi PeteB... I dont think you will find any Specs...but that I do not know. What I do know is it depends on the make up of your PCB and Components. Obvious haveing components that may be sensitive to heat the less you want to run or pass through. Re
