Electronics Forum | Fri Dec 12 11:52:59 EST 2003 | Marc Simmel
I have encountered problems with a 90/10 tin-lead plated SMT component wicking all the solder paste off the pads on the substrate. Worst, the defect occurs randomly - adjacent leads may have 'good' joints, though heel fillets are poor. The solder pa
Electronics Forum | Fri Dec 12 17:19:08 EST 2003 | davef
Here's two angles to think about. Solder goes to the component and not both the board and the component because: * Component lead is much hotter than the the pad on the board. [This probably doesn't apply in your case, because it doesn't repeat fro
Electronics Forum | Wed Dec 17 06:50:51 EST 2003 | ex maintain leader
140..155 degrees celsus the limit is your inserted component temp schock tolerance
Electronics Forum | Sun Jan 18 09:38:34 EST 2004 | m_imtiaz
we are facing cold joint problem in selected component please advise me possiblity of this problem imtiaz
Electronics Forum | Wed Jan 28 20:26:32 EST 2004 | Vinny
Hi Guys, Really need your help to suggest how to tackle this situation.
Electronics Forum | Thu Mar 18 18:36:28 EST 2004 | jj
Thanks, Dave Is that for cleaning component or PCB ? JJ
Electronics Forum | Fri Mar 26 17:29:07 EST 2004 | ben
try gc prevue
Electronics Forum | Mon Mar 22 08:43:13 EST 2004 | pjc
This is a great site to find many mfrs. data sheets: http://www.freetradezone.com/
Electronics Forum | Tue Apr 20 20:11:58 EDT 2004 | davef
First, how oxidized are these solder balls? Will the take solder using your routine flux / paste? Second, on restoring solderability, the three basic methods you can use to restore solderability on components are: * Highly active fluxes in a retinn
Electronics Forum | Wed Apr 28 01:43:25 EDT 2004 | wolf1
Does anyone know how to skip a component while in full auto mode on the HSP?
