Electronics Forum | Mon Jul 24 10:00:08 EDT 2006 | SWAG
I think I read a thread very similar the other day but can't find it. If I remember correctly, the component database for that part was polarized and pre-orientation was used for camera inspection. It turned out that the optimization module in the
Electronics Forum | Mon Jul 24 11:35:42 EDT 2006 | Jimk@ics-inc.org
We have experienced a problem with tin leaching or discoloration of lead terminals on random parts on solder side of a paste/paste operation. The profile has been used on previous production runs and there doesn't appear to be any heat damage to othe
Electronics Forum | Wed Jul 26 12:39:00 EDT 2006 | spari77
we encounter some open joint on the CPU socket after rework. We tried to reflow the boards again (using BGA rework machine) and found that the contact issue was resolved. Is there any risk to perform a reflow again on the CPU Socket boards without re
Electronics Forum | Fri Jul 28 11:01:45 EDT 2006 | rlackey
No, you can easily find out if it's a part issue - put down another component with the same footprint(either a chip cap or a different value resistor - like the one in the picture)on the pads where you are having problems and relow as normal. If it
Electronics Forum | Wed Sep 13 09:15:19 EDT 2006 | Rob
Hi Peter, Out of the 1.5 billion components we shipped last year, we had 3 components back for solderability issues. All 3 had been taken out of their vacuum packaging and left to oxidize for a number of weeks. We don't see it as an issue, but we
Electronics Forum | Wed Sep 20 14:20:44 EDT 2006 | Rafael
Dear all, Does anyone know how can I duplicate feeders in the same carriage of the HSP? The issue is: 2 sequenced feeders (101 and 102, for example) with the same part numbers. I need that, when feeder 101 ends, the machine should pick the componen
Electronics Forum | Tue Oct 03 13:08:39 EDT 2006 | Moby
This is an issue that we are seeing a lot! It used to be that the primary-side (component-side...top-side) had most of the active components. It was simple: reflow bottom first. Now, we are seeing both sides of the assembly having the same amount of
Electronics Forum | Thu Oct 12 09:22:12 EDT 2006 | charless
Hi We are experiencing different failure modes between leaded and lead free through hole assemblies. The boards are PTH. In the case of lead free boards we are seeing fracturing of the component legs much earlier than we do with leaded assemblies. N
Electronics Forum | Tue Nov 28 20:12:41 EST 2006 | davef
We don't have a gap between the lead and the pad after a SM joint is soldered. On our boards, this space is filled with the solder intended to attach the component to the board. How high do components sit above the surface of a board? Most people a
Electronics Forum | Wed Dec 06 16:34:43 EST 2006 | mscalzo3
The final reflow profile really depends on which of the components are Pb-Free (such as BGA's) and the lowest temperature limit of the components. I'd be glad to share with you some ideas for solving your particular issue. Please contact me offline
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