Electronics Forum | Wed Mar 23 13:19:40 EDT 2011 | bwjm
Charlie, thanks for the reply. But I am still unclear with the machine capabilities. Does the standard ke740 able to place 01005 components or is it the machine was upgraded to place 01005? This is my first time getting a placement machine, I am quit
Electronics Forum | Fri Apr 08 06:18:41 EDT 2011 | don7888
Thanks Everyone I have attempted to take an average for the all the components but this but theres such a range of times I don't think this is accurate enough maybe I should try for the different types of sizes of components. As for the cycle time I
Electronics Forum | Fri May 20 09:13:58 EDT 2011 | ck_the_flip
We have issues with the Philipps Luxeon Rebel LED where the part sticks to the cover tape during advancement. This causes the part to get flopped around in the pocket or the component gets dropped and damaged when the feeder advances. Has anyone ex
Electronics Forum | Mon Jul 11 13:49:34 EDT 2011 | sarason
The program reads the Altium PCB directly and does some preprocessing, like centreing DPAK's etc. The ordering of components can be sorted by Designator. Top, bottom, SMT only components can be selected. There are 2 variation on VIOS :- JH_YM100_VIOS
Electronics Forum | Fri Nov 25 04:10:21 EST 2011 | bwjm
Hi, I am facing some problems on my soldering joint. My operators perform the solder and left the assembled PCBs on the WIP rack. After 1 week (Due to shortage of components),the solder joint of the components darken. Is it caused by oxidation? If ye
Electronics Forum | Fri Apr 20 01:42:37 EDT 2012 | thmeier
If you extend the pads you get the effect that the solder below the component is pushed to the outside land which results in a very low standoff of the component, deteriorate the overall quality of the solder joint. Hot air (pencil or some of the sem
Electronics Forum | Wed May 16 11:19:08 EDT 2012 | fulgen
Hi Guys, I´m looking for information about processing smt components on flexible printed circuits (printing, SMD assembly,reflow soldering and laser cuting). These flexible circuits comes from a roll of 300 mm width. I found some information about ro
Electronics Forum | Wed Jun 27 13:38:56 EDT 2012 | upguy
Thanks for the information and insights. Our booster is probably getting too hot, even with AC. There is bouncing when we trim component locations. Every so often, while trimming component locations, the x-axis will start to slowly move away (by i
Electronics Forum | Wed Jul 04 12:18:14 EDT 2012 | davef
Phil is correct in his description of proper rework technique. Possible explanations of the reason for popping of your BGA are: * Thermal cycling of components cause them to flex on a different point in the cycle that the board possibly resulting in
Electronics Forum | Tue Aug 07 01:19:49 EDT 2012 | reypal
Thanks DucHoang, More input: 1. Tin/Lead s.paste on Pbfree component 2. Machine pick and place 3. Reflowed@ 210-230C peak @ around 15sec. 4. Boards are subjected to washing process 5. This issue can be seen after washing process. Do you think it
