Electronics Forum | Tue Nov 15 10:19:27 EST 2005 | James
Can I dip the populated board in flux and achieve good results? Also how easy is it to clean the flux off the board afterwards if it is waterbased? Do you simply brush the board with a damp brush or spray some remover on the board? I also have this q
Electronics Forum | Mon Nov 21 01:10:27 EST 2005 | mskler
We are facing the problem of dry soldering in chip capacitor 0603. When we told the Vender then he just told that we are using solder paste with 62/36/2 combination & the components are lead free so there is prob. of dry soldering. While we are usin
Electronics Forum | Thu Nov 24 21:19:40 EST 2005 | smartasp
Hi, We are also a hig mix low volum plant situated in Sri Lanka and just installed 2 Opals inline from Assembleon with the feeder exchange carts for faster change over. This machines can be upgraded to Topaz by just installing 4 more heads. So far
Electronics Forum | Sat Dec 10 19:10:17 EST 2005 | mika
Most of the chip; res & caps are already lead-free or RoHS compliant and you most certainly already solder them in your regular leaded reflow process. However, there are a few more component packages except from BGA:s that are NOT backwards compatib
Electronics Forum | Wed Feb 01 17:03:04 EST 2006 | grantp
Hi, What's the difference between soldering a lead free solder ball BGA onto a footprint with lead solder paste when the ball does not collapse, compared to a lead-less package. The BGA is bigger, but you rely on the solder paste only, seems to work
Electronics Forum | Tue Dec 06 14:30:49 EST 2005 | Samir Nagaheenanajar
I agree with Ken!! Amen to that, brother! At my company here in Rihad, our design guys are in a tizzy about lead free components and tin whiskers, and with every questionable through-hole solder joint, or when our purchasing department gets "notif
Electronics Forum | Tue Dec 06 18:29:45 EST 2005 | darby
You may also wish to check the speed controllers for both descent and ascent. The higher the ascent speed the more force the jaws close with. It can be difficult to achieve a "good" nozzle placement height as this is mechanically set and your lowest
Electronics Forum | Mon Dec 12 09:39:39 EST 2005 | Amol Kane
thank you devef....My point is this....If you solder all the areas that have Imm Sn on them, there wont be any whisker formation DUE TO THE IMM TIN COATING.....whiskers could still potentially form as a result of COMPONENT FINISHES and effective miti
Electronics Forum | Thu Jan 12 01:07:34 EST 2006 | pavel_murtishev
Good morning Mark, CAM (Computer Aided Manufacturing) products are designed to solve such tasks. You can try CAM350 for example. CAM350 understands different ASCII exported data from different CAD systems. CAD ASCII export contains all necessary inf
Electronics Forum | Fri Jan 13 14:18:41 EST 2006 | mark
Hi, I would like to ask you how you test the PCB (electrical test) of first PCB before starting production.? What kind of equipment you are using? and method to confirm that components on PCB are correct (value, orientation, describtion, polarizatio
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