Electronics Forum | Mon Jan 06 12:33:14 EST 2003 | gregp
I feel an SMTA vision award coming on. A depth guage sounds like a great idea (especially one designed specifically for that purpose). It should readout "components remaining". But until that product is avaialble, why not just save some of the empt
Electronics Forum | Thu May 13 09:47:32 EDT 2004 | Lubo
We are looking for a inspection system to check the positioning of a component over a PCB. We need it positioned both in X Y directions and height above PCB (it is a TH component) to be within certain limits. PLS advise can this be achived by AOI. Wh
Electronics Forum | Tue Jun 07 19:24:26 EDT 2005 | Joseph
Dear all, Recently we encountered some functionality failure when using lead-free component(Sn99.3/Cu0.7)at SnPb(Sn63Pb37) wave soldering process. Can lead-free component use at non-lead free process? Any input/idea are much appreciated. Rgds
Electronics Forum | Mon Nov 26 22:05:34 EST 2007 | shy
currently i'm open my stencil aperture is 80% from the land pattern. is this will cause insufficient solder at the terminal component or not? the stencil thichness is 6mil and the board run using SMT pallet which i consider there will be no option f
Electronics Forum | Thu Nov 29 13:05:46 EST 2007 | stepheniii
I really hate to ask but must. Are the components that are falling off, the components that don't have glue? Seriously not all the parts on the bottom are glued on? How do they stay on during the wave? The normal way is to run the top SMT as normal
Electronics Forum | Wed Aug 24 12:10:20 EDT 2011 | atgservice
Hi All I need some advice , hope you guys can help. Is Juki KE750 able to mount 0201 components? Well, according to the nozzle catalogue, there is a special nozzle ( No. 149 ) which is smaller in diameter than the Nozzle 101. It says that this noz
Electronics Forum | Tue Aug 22 14:59:55 EDT 2000 | Mike Naddra
What does the reflow profile look like , the question I had was surrounding the higher reflow temperature and the max temperature that lowest thermal mass components will see. Some other questions that I had were surrounding the components , what of
Electronics Forum | Tue Nov 27 14:56:33 EST 2007 | jaimebc
Shy, What is your current method of applying adhesive? If the terminals of the component that has adhesive are not wetting ( or not forming a solder joint I think we are talking about ) after reflow, then you must be applying too much adhesive. As
Electronics Forum | Tue Aug 17 15:58:14 EDT 2010 | rob_thomas
IPC-7711/7721 states under Scope section: "This document does not limit the maximum number of rework, modification or repair actions to a Printed Circuit Assembly". This is from Rev B of this standard. There are many factors that play a role in the d
Electronics Forum | Mon Jul 31 07:37:57 EDT 2023 | tommy_magyar
Hi Simon, Yes, red glue should help, assuming that it is being dispensed by a glue dispenser. For stencil printing I used yellow glue in the past (can't remember the brand). Your pick and place machine should be able to achieve on it's own 35 um
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