Electronics Forum | Wed Jul 06 16:57:32 EDT 2005 | jasont
Hi Darby, What is the cph rate and component range for the CSM 84VZ? Thanks, jason@tekmart.com
Electronics Forum | Tue Jul 12 03:58:46 EDT 2005 | Chris Ong
Hi Bob, I heard that they have low temperature solder that is able to tackle heat sensitive component. Some of my industrial friend also mentioned that they some sort of low cost material alloy -SCS7?? Is that true? Thanks Chris
Electronics Forum | Thu Jun 30 12:20:50 EDT 2005 | sumote
Its been my experience that a "dot" of glue on the center of the part is needed for "barrel" type components.
Electronics Forum | Thu Jun 30 12:27:58 EDT 2005 | kmorris
I'm not familiar with this particular oven, but have seen this problem once before. As it turned out there was a flexible curtain near the end of the reflow tunnel on the oven. Some very fine strands had frayed from the curtain and were catching on
Electronics Forum | Thu Jun 30 13:49:36 EDT 2005 | John
I had the same incident before, and like GS pointed out, the degassing from the via under the component was responsible. The via was covered with solder mask, but it burst open during the reflow.
Electronics Forum | Sat Jul 02 06:19:01 EDT 2005 | Dhanish
My customer feedback they found one board with cold solder on the BGA ball.I looked at the picture,the ball looks very shining but I dont think that is a cold solder.What is the method can be used to confirm the colde solder beside cross sectioning t
Electronics Forum | Tue Jul 05 15:21:46 EDT 2005 | russ
So your thermal cycling test is putting these solder joints into reflow (183C + if they are lead joints)? Must be quite the test! Tell us what pad sizing and spacing you are currently using.
Electronics Forum | Thu Jul 07 07:18:50 EDT 2005 | davef
Sounds like you need to turn-up the dial of your oven. Solderabilty protection finishes on components are changing, whether it makes sense or not.
Electronics Forum | Thu Jul 07 18:03:27 EDT 2005 | russ
Sarag, FYI tombstoning is a functional failure. Tombstoning is where one end of the component is not soldered and is in the air above the board/solderjoint surface. You may be thinking of billboarding (part on its side with both ends soldered down)
Electronics Forum | Wed Jul 13 16:44:12 EDT 2005 | dk
Hello all. I need a file or a link to a kind of library for package, component picture and description. I need it for programming AOI templates. Thanks. Good day