11393 component results

Electronics Forum: component (Page 426 of 1140)

Hybrid reflow profile

Electronics Forum | Mon Oct 03 10:20:43 EDT 2005 | davef

Follow your component supplier recommendations. For instance: Xilinx says their lead-free alloy for their BGA spheres is SnAgCu, and liquidous is 217*C and they want you to peak at 230 - 235*C for good wetting according to their reflow guidelines.

failure of ESD sensitive chips

Electronics Forum | Sun Oct 09 10:58:53 EDT 2005 | Mika

Of course all electric components are ESD-S. But what I ment, was there any particular extra ESD-S chips. Sincerly,

Fuji Flexa, IP2 pd for connector

Electronics Forum | Fri Oct 21 03:56:47 EDT 2005 | aj

I agree, Vision 254 should do the job. Input total x and y dimensions of the component.

Tin Whisker Testing

Electronics Forum | Tue Oct 11 14:10:51 EDT 2005 | Amol

Hi, I have a very basic question for tin whisker testing. Do I thermal cycle/age the Components only or solder them to a ckt board and then thermal cycle/age the PCB assembly??

Lead disposal of Component leads?

Electronics Forum | Tue Oct 18 13:18:30 EDT 2005 | DG

We just put them in with the dross from our wave machine. It all ends up @ a metal recycler anyway. DG

limitation's of the QSA 30 machines

Electronics Forum | Fri Oct 21 23:10:28 EDT 2005 | valuems

Hello Will the user's of the QSA machines let me know how well these machines pick and place the 0201 component's? Is the feeders good , bad or so so. And isn't there a company that is maufacturing, knock off feeders? Is the spare parts still avai

V-score cracking components

Electronics Forum | Tue Nov 08 17:12:10 EST 2005 | Erik

I haven't heard of heating boards pre-depanel either. We have done extensive studies on cracking of ceramic caps close to V-scored edges and have decided to have our board vendors pre-rout any areas with caps close (