Electronics Forum: component (Page 46 of 1140)

Reflow soldering problems and traces under component

Electronics Forum | Tue Jul 19 08:26:46 EDT 2016 | pavel_murtishev

Aleksander, The answer is no. Solder deposit being printed is 80um-150um in height depending on PCB design what is two times higher than any track covered by solder mask. Molten solder will merely center the component. QFNs are prone to soldering

Increasing size tolerance to reduce component rejection

Electronics Forum | Tue Sep 27 11:43:32 EDT 2016 | tnisbet

Yes you can open the tolerance, and that’ll usually work for a bit. Is the LAE is linked to multiple parts? If so, then the easiest thing is to open the tolerance. If not, that’ll require another route to try. Is it happening to all of the components

NTC crack on body of component

Electronics Forum | Wed Sep 12 03:43:48 EDT 2018 | vlad_saviuk

Hello, have some problem and interesting, does any body faced with same issue. On most of our products we have NTC thermistor(like on the photo), and during assembly process and handling great amount of components cracked on PCBA so we need to replac

Leadfree component plating on Sn/Pb paste

Electronics Forum | Wed Jul 02 07:00:56 EDT 2003 | davef

Title : SOLDER JOINT RELIABILITY OF Sn-Ag-Cu BGA COMPONENTS ATTACHED WITH EUTECTIC Pb-Sn SOLDER PASTE Author : Fay Hua et al. Author Company : Intel Corporation Date : 01/01/2003 Source : Journal Of Surface Mount Technology, Volume 16-

LGA component rework process on SRT machine

Electronics Forum | Fri Jun 04 11:54:22 EDT 2021 | cbart

We do this quote often with our older Summit machine. there are a few ways to do this. all of these are assuming you have parts on the boards already and are working around them. 1- if you have a good tech that can add solder to the pads on the PCB a

Reliability assessment SnPb joints to lead-free component

Electronics Forum | Thu Jun 09 05:04:05 EDT 2005 | Joseph

Dear Patrick, Unfortunately we do not know what exactly the failure as our customer refuse to reveal to us. From visual inspection the solder joints are smooth and shiny as per IPC-A-610 requirements. The component supplier (IR) commended that they

automatic placement of pin through hole component

Electronics Forum | Wed Feb 09 08:54:42 EST 2000 | pascal MATHIEU

Hello friends , in order to try to reduce our labour cost , we are thinking to replace manual placementof PTH COMPONENTS by automatic unit which 'll be able to place relays ,and connectors . is there anybody on this forum to advise us on this topi

Question on 4785 component database Universal chipshooter

Electronics Forum | Fri Nov 09 14:23:12 EST 2001 | vickt

You are correct...These are proprietary codes. Your best bet is to stick to the UCT-31. Other folks have tried to create a tool of their own, but have had little success. Universal Instruments offers component library conversion tools as well as patt

Reliability assessment SnPb joints to lead-free component

Electronics Forum | Thu Jun 09 06:15:17 EDT 2005 | Clampron

Joseph, We have all been using lead free components for some time. Many passive already have a Pb free plating and we have not seen catastophic failures on them. From the information I have seen, I think this should be OK (with the exception of BGA'

Clearance between Through hole and chip component

Electronics Forum | Tue Feb 27 20:53:10 EST 2007 | davef

We'll guarantee the two pads are too close together. The proper spacing depends on the orientation of the parts to the wave. * Do the pads hit the wave at the same time? * Does one pad hit the wave before the other? If so, which? * How does the 06


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